产品开发管理系统简介PDMSIntrodu.ppt

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1、產品開發管理簡介 p.1,產品開發管理系統簡介PDMS簡介,新產品開發流程(NPI)P0:建議階段 ProposalP1:計劃階段 PlanP2:設計階段 DesignP3:實驗試作階段LPRP4:工程試作階段EPRP5:生產試作階段PPRP6:量產階段 MP,產品開發管理簡介 p.2,產品開發管理系統簡介P System,產品開發管理簡介 p.3,Product Feasibility(PM:DOC-003),Resubmit orReason for theCancellation(Product Strategy),Sales Channel(Sales),ProductDevelopm

2、ent(R&D),Market Scale(Marketing),ComponentsSupply(Purchasing),Factory Plan(Manufacture),Financial BackupFor new BU(Financial),SetupTeam for Feasibility Study or Product Review Committee,Market Requirement Spec.(PM:DOC-001),Customers RFI/RFQ(Sales),Product Techniqueor Design Innovation(R&D),Proposal

3、orConclusions inKey Staffs Meeting,Company Goal&Policy(President Office),Major SuppliersStrategy(Procurement),Market/IT InfrastructureProduct Roadmap(PM:DOC-004),YESGO,Strategic Product New Product Line New BU Massive Investment,ProductFeasibility Review(PS),Strategic Meeting(PS),NO GO,Abandon,Mock

4、up sample Memo system Technical demonstration,產品開發管理系統簡介 P0 建議階段,PM Market Requirement Spec.(001)Product Feasibility Report(003)Product Roadmap(004),產品開發管理簡介 p.4,Oral Discussion Written Review Meeting,Product Preliminary specProduct Development plan Task Force(105)Master Schedule(102)NRE Budget(103)

5、PCBA Firmware Software Mechanical Packing Graphics Manual System ID Drawing(109)Certification(108)Regulation(106)Market Promotion plan,Revised,Market Trend Roadmap Enhancement(PM:DOC-004),Technology InnovationDesign Quality Escalation(R&D),Customer Contract Market Feedback(Sales),OthersDFT,DFM,DFR,P

6、roduct ProposalFeasibility Study(PM),RequirementsReview(PS,PM),Product MeetingNotice,Draft of ProductDevelopment Plan(R&D),Market Promotion Plan&Schedule(Marketing),Model Name&Comparison Chart(PM:DOC-107),Product Design ScheduleP1P6 Release Item(R&D:DOC-111),Design Verification&Validation plan,Key P

7、arts SourcingEngineering P/R Request(PM:DOC-110),Chipset Roadmap&IT Infrastructure(PM),CustomersRequirements(Sales),ComponentsSupply Status(Procurement),Production Capacity and Capability(Manufacture),Remark:After new product development meeting,Project Manager must apply packing level BOM,News Prod

8、uctDevelopment Meeting(PM),ODM RFI/RFQ Check List(PM:DOC-002),產品開發管理系統簡介 P1 Plan 計劃階段,PM ODM Phase In Check List(002)Product Roadmap(004)Time Schedule(102)NRE Charge Estimation(103)Project Team(105)EMI/Safety Request(106)Model Define&Comparison(107)Certificate Request(108)Pilot Run Request(110)R&D I

9、D Drawing(109)P1P6 Release Item(111),產品開發管理簡介 p.5,PCB Layout Post-layout SimulationCAD SimulationMock Up Test,Product EngineeringSpecification,Circuit Schematics2D/3D DrawingsCAD Simulation Part List/E-BOM,R&D InternalDesignReview(R&D),Design ExternalReview(R&D,ENG),Design or GuidelineModification,R

10、evisedIssue DCR,Key Parts Application,Schematics Mechanical Drawings Mechanical Dimension,Key Parts Discrepancy list,Design GuidelineDFX,Design Guide,產品開發管理系統簡介 P2 Design 設計階段,R&D Design Review Report(218)Engineering Spec.(201)Part List/E-BOM(202)Schematics(204)Operation Guide(205)PCB GERBER/FILM(21

11、0)PCB Outline Drawings(209)CRITICAL PART S(215)Design Variation/Expand(217)Cost Estimation(220)Mechanical Drawings(214)Structure Layout(216)Sys Explosive Chart Module Interconnect Module Block Diagram Invention Disclosure(207)Mock Up Function Test(219)PM Product Specification(206)Configuration List(

12、203)TSD DVT Plan(221)PE DFM Review Report(222)Production Procedure Plan(203),產品開發管理簡介 p.6,R&D Project Transfer(317)E-BOM(302)QVL(303)Schematics(304)GERBER/FILM(305)Carton Packing Description(309)EMI Evaluation(312)PCB Revision History(327)Appearance Description&Check Spec.(321)Firmware History(325)P

13、reliminary User Manual TSD IC Master(320)DVT Bug Report(311)Design Test Report+DVT(326)PE Test Equipment List(306)Assembly Drawing(328)Screw Torque Spec.(329),Issue DCN,EMC Pre-Test&Safety Pre-testCalibration(DOC-312),PCBA Debug/ModifyT1 Sample ModificationSignal Integrity TestCertification Pre-test

14、,Pass,DVT Test ApplicationFeedback,EMC/SafetyModification,EMC Pre-Test ApplicationSafety Pre-Test Application,DesignVerificationTest Review(R&D,DVT,ENG),Significant ChangeBack to P2,Unresolved Fatal Failure,Design VerificationTest Report(DOC-311),Abandon,PCBA V.A.Proto.T1 Tooling Design,Pre-Engineer

15、ingVerificationTest,Pre-EVTTest Report,Pass,Failure,Failure,Design Verification TestDVT,產品開發管理系統簡介 P3 LPR 實驗試作階段,Issue DCR,Issue DCR,產品開發管理簡介 p.7,Bug List,EMC Test&Safety TestCalibration,PCBA Debug/ModifyTi Sample ModificationSystem Integrity TestCertification Test,Pass,EMC/SafetyModification,EMC Te

16、st ApplicationSafety Test Application,EngineeringVerificationTest Review(ENG,EVT,R&D,QA),Significant Design IssueBack to P2,Major Issues,Design VerificationTest Report,PCBA Rev B-E EST2-Tn Tooling ES,Industry CertificationTest,EVTTest Report,Design Verification TestDVT,DVT Test ApplicationFeedback,產

17、品開發管理系統簡介 P4 EPR 工程試作階段,R&D SPR(401SP)FER(410F)HER(410H)SER(410S)GDR(410G)MER(410M)UMR(410U)PER(410P),PE Test Procedure(406)Mfg Equipment List(407)Production Flow(SOP)(408)Assembly Drawing(409)Standard Time(410)Engineering Version(411)Trouble Shooting Guide(412)Golden Sample(413)Safety EMI App./Cert

18、ificate(417)Safety App./Certificate(418)QA/QE EVT Test Report(415)MVT Test Plan(416)OQA Inspection Procedure(414),產品開發管理簡介 p.8,Pass,Out-Sourcing PartsApproval,Failure Analysis Rectification Actions,SpecificationBOMGerberSystem Explosive ChartSchematicsMechanical DrawingsBlock DiagramDVT ReportEVT Re

19、portProduction Management PlanSOP/WIEngineering ToolingFabrication FixturesSIP,Test ProgramInspection FixturesPallet PackingSpecial Note,PPRDoc.Verification,NPI Production Validation,MassProductionIntroduction,ManufactureVerificationReview(QA,ENG,MFG),1.During Pilot-Run stage,R/D may issue DCR/DCO t

20、o take any action necessary to fulfill the Pilot-Run fast turnaround cycle2.After Pilot-Run,all of the DCR/DCO issued during NPI must be combined into ECN(s)and issued by Design party,Q.A:Quality Validation,Quality planEng:FPY,Line Efficiency,Process,Firmware Design ReleaseFER,MechanicalDesign Relea

21、seMER,Packing Design Manual ReleasePER/GDR/UMR,S/W Design ReleaseSER,OBM/ODMDesign Kits,Pre Pilot Run Meeting(ENG,QA,MFG),OEM Manufacture Kit Release,ManufactureVerificationTest Report,Failure,Need More Information,Rectification,產品開發管理系統簡介 P5 PPR 量產試作階段,QA PCBA Inspection(502)Product Inspection(503)

22、Safety Checklist(506)MTBF(507)MVT Report(509)ENG SOP(508)Transfer Agreement(510)Technology Certificate(511)R&D Phased out bulletin(602)Project Termination(604),產品開發管理簡介 p.9,產品開發管理系統簡介 DCR/DCO during NPI,.,CrossReferenceR&DENG,IssueDCRDVT/EVTR&D PM,LPR/1EPR/1ENG,Remarks:1.DCO can be issued by R&D to

23、start a new EPR in NPI stage or a pre-ECR/ECO EPR in MP stage 2.DCR can be requested by any engineering related divisions to specific R&D unit 3.DCR can be requested by one R&D unit to another R&D units to make sure the system-wide compatibility 4.DCR can be requested to R&D when Correction Actions

24、to resolve design related quality abnormalities CQA:Customer quality claims VQA,Strategic procurement:Key component(Q,C,D,S)abnormality IPQC,Engineering,Manufacture:Engineering or Manufacture abnormality inside factory,DVT/iEVT/i ReportDVT/EVT,IssueDCOR&DENG,LPR/i+1EPR/i+1R&DENG,Release toPPR,Key Pa

25、rtsAbnormalityPurchasing,1st DCOR&D,Failure,First Pilot Design Release V.Aw/Specification,P/N,BOM Schematics,Gerber,PCB FAB,產品開發管理簡介 p.10,產品開發管理系統簡介 Pre-ECR/ECO Activities,.,CrossReference,IssueDCO,IssueDCR(Any),EPR工程試作,Duplication/Analysis,Customer QualityClaims,CQA,Remarks:1.Manufacturing Notice(M

26、/N)is used inside the factory.2.Engineering Notice(E/N):Regular engineering notice(Can not be used to modify BOM).3.Engineering Release(E/R),ECR/ECO or ECN in brief:Permanent engineering document release and change notice 4.System/Product Release(SPR),System Change order(SPCO):Permanent finished pro

27、ducts document release and change notice.SPR and SPCO are related to the product configurations,but not related to the H/W and F/W design 5.PCR(Product Change Request)and PCO(Product Change Order)are used to notify the customers the product configuration changes,EC(Engineering Changes)related to the H/W and F/W design.,DesignRelated,ECRWorkflow,ECRNeeded,OtherCAR,Alternate Key parts,FactoryQualityAbnormality,IPQCVQA,ProposedCAR,Yes,Yes,No,