常见的表面工艺处理及不良分析.ppt
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1、表面处理工艺Surface Treatments Processes20-Apr-09,常用表面处理工艺,水镀 Normal Plating真空电镀 PVD Physical Vapor Deposition 电泳 Electrophoresis电铸 Electroform抛光 Polishing蚀刻 Etched镭雕 Laser Carved氧化 Oxidation 喷砂 Sand blast批花(一般对logo进行处理)Shiny Logo拉丝 DrawbenchCD纹 CD line其他 OtherR&D相关产品工艺 R&D Relative Product Process,1.水镀 N
2、ormal Plating,电镀原理:指借助外界直流电的作用,在溶液中进行电解反应,使导电体(例如金属)的表面沉积金属或合金层。电镀分类:Barrel Plating 滚镀,Rack Plating 水镀。,机械整平,上挂检验,Process:,超声波除腊,热侵除油,电解除油,酸活化,预镀碱铜,镀焦铜,镀酸铜,镀白铜锡,过沥架,1.水镀 Normal Plating,滚镀生产线,水镀生产线,除腊,除腊后上挂,除油,酸活化,镀焦铜,酸清洗,镀酸铜,镀白铜锡,1.水镀 Normal Plating,水镀常见问题:麻点:胚料表面不平整或电镀液有杂质。气泡:电镀层里有空气或聚集着电镀液,一般以小面积形
3、状出现。电镀层附着力不足,脱落;(Eseries Dawn Strap metal piece plating layer peel off)。电镀层与胚料之间或镀层彼此之间的附着力不够,一般以较大面积出现。烧焦:在镀件尾部和边缘一带产生了粗糙或其它不满意的镀层,颜色暗或灰白。水渍:电镀后工件藏水,当水烘干后在工件会出现一些花痕,不易擦去。,1.水镀 Normal Plating,水镀常用颜色:无叻叻色(“无镍白铜锡”-”No nickel and white Copper Tin”);枪色(Gun Metal Color);金色(Golden Color);珍珠银、珍珠白(Pearl Sil
4、ver/white);,1.水镀 Normal Plating,一、吊镀价格(仅供参考,以时价为准),二、原材、型材镀锌价格:11.5元/Kg,Customer has released critical requirement to control Ni/Co substance in metal part plating.NOKIA-banned plating Ni/Co in metal part surface.SE-banned plating Ni in metal part surface.Motorola-banned plating Ni in metal part sur
5、face.客户提出禁止产品电镀层中含有镍/钴成分。Influence for our products:Silver color part:we can not use Ni as undercoating layer any more.Gun metal color part:we can not use Co to tune color of plating surface.对我们产品的影响:银色不能用镍成分,枪色不能用钴进行调色。Objective:Need to search new process for metal part plating to avoid using Ni/Co
6、 substance.目标:寻求新的电镀工艺:避免使用镍/钴。,1.水镀 Normal Plating,Normal Nickel plating process:“Cu+Ni+Cr”.It is a mature process,it can pass wearing vibration test smoothly.Aim at it will cause allergenic of skin,customer has banned to use it.常规银色镍电镀可以通过耐磨测试,但由于其会引起皮肤过敏,客户已经要求禁止使用。Replace plating process:“No nic
7、kel and white Copper Tin”.To pass wearing vibration test,Sn thickness should be controlled at about 0.71.0um.Require to coat harder organic film.Remark:Surface rigidity of“No nickel and white Copper Tin”process can not reach the same level of“Cu+Ni+Cr”process.改善后的银色电镀电镀用锡代替镍。Plan to study other proc
8、esses to achieve silver color:Use stainless steel material to replace Zinc material,use PVD to replace normal plating to achieve silver color.Use stainless steel inherent color after polished(need not any other plating).Use plastic part replace metal part,use PVD to get silver color.Remarks:PVD-Phys
9、ical Vapor Deposition.其他工艺:使用不锈钢进行真空电镀,使用不锈钢原色等。,“Cu+Ni+Cr”Process,“No nickel and white Copper Tin”Process,1.水镀 Normal Plating,“PVD”Process 2,Normal gum metal color plating process:“Cu+Sn+Co”.It is a mature process,Co element is used to tone gun color,it can pass wearing vibration test.Aim at it wil
10、l cause allergenic of skin too,customer has banned to use it.常规枪色电镀,用钴进行调色,但由于其会引起皮肤过敏,客户已经要求禁止使用。Plan to study other processes to achieve gun metal color:“PVD”process 1:plating one Cr layer at base substrate Zinc,then arrange the part for PVD.Defect rate of this process will be higher than single p
11、lating process.“PVD”process 2:use stainless steel material to replace Zinc material,use PVD to replace normal plating to achieve gun metal color.Use plastic part replace metal part,use PVD to get gun metal color.改善建议:1、锌合金用水镀真空电镀避免使用钴;2、不锈钢真空电镀部门使用钴;3、用塑胶代替五金件。,“Cu+Sn+Co”Process,“PVD”Process 1,1.水镀
12、Normal Plating,2.真空电镀 PVD,真空电镀:PVD(Physical Vapor Deposition 物理气相沉积),是指在真空条件下,采用低电压、大电流的电弧放电技术,利用气体放电使靶材蒸发并使被蒸发物质与气体都发生电离,利用电场的加速作用,使被蒸发物质及其反应产物沉积在工件上。真空电镀分类:真空蒸镀、真空溅镀、真空离子镀。NCVM真空溅镀:Non-Conductive Vacuum Metallization真空溅镀原理主要利用辉光放电(glow discharge)将氩气(Ar)离子撞击靶材(target)表面,靶材的原子被弹出而堆积在基板表面形成薄膜。真空溅镀薄膜的
13、性质、均匀度比蒸镀薄膜好,但是镀膜速度比蒸镀慢。涂层类型:TiN,ALTIN,TiALN,CrN,CrCN,TiCN 和 ZrN,复合涂层包括 TiALYN 或 H/DLC。工艺温度:PVD 涂层加工温度在 250 450 之间,在有些情况下依据应用领域和涂层的质量,PVD 涂层温度可低于 70 或高于 600 进行涂层。涂层厚度一般 0.51um,有些情况下,涂层薄至 0.3um,厚至 15um。涂层种类和厚度决定工艺时间,一般工艺时间为 36 小时。,2.真空电镀 PVD,真空蒸镀、真空溅镀、真空离子镀对比,Besides normal zinc alloy gun metal plati
14、ng(contain:Co),there are another two PVD methods to avoid using Co for gun metal color.避免使用钴的真空电镀方式:PVD method A:Use stainless steel to replace Zinc alloy,use PVD to replace normal plating to achieve gun metal color.-PVD plating quotation is about 20%40%higher than normal plating.Defect rate is abou
15、t 2%5%(normal plating defect rate is about 3%8%).Price of stainless steel is about 30%200%higher than zinc alloy.方式A:使用不锈钢,用真空电镀代替水镀(钴)。但费用会比锌合金水镀贵。PVD method B:plating one Cr or Sn layer at base substrate Zinc,then arrange the part for PVD.-As method B need normal plating+PVD,plating quotation is 8
16、0%100%higher than normal plating.Defect rate will be increased to 10%20%.方式B:使用锌合金,先水镀再做真空电镀。但费用会比单独水镀贵。,PVD Method A,PVD Method B,2.真空电镀 PVD,Advantage:优点More color can be chosen with PVD plating process.真空电镀颜色选择多。PVD is more friendly for environment.真空电镀更环保。PVD coating is stronger,and the PVD coati
17、ng is more harder.The PVD coating also has better wear resistance,better corrosion resistance and better chemical stability.真空电镀镀层硬度及强度较水镀高,耐磨性好,具有更稳定的化学性能。Disadvantage:缺点To achieve different testing requirement,price of PVD plating will be double or triple of normal plating.为满足不同的测试要求,电镀费用是水镀的两倍以上。
18、Using PVD method A for gun metal color,unit price will be increase about 50%100%,or more.使用真空电镀实现枪色,产品单价会增加50%100%。Using PVD method B for gun metal color,defect rate will become a bottleneck.水镀真空电镀工艺,不良率将是一个显著问题。Using PVD method B for sampling,lead time has to extend about 23days.水镀真空电镀工艺,打样周期将会增加23
19、天。,2.真空电镀 PVD,水镀与PVD对比-Frank.Long,电泳工艺:分为阳极电泳和阴极电泳。若涂料粒子带负电,工件为阳极,涂料粒子在电场力作用下在工件沉积成膜称为阳极电泳;反之,若涂料粒子带正电,工件为阴极,涂料粒子在工件上沉积成膜称为阴极电泳。阳极电泳一般工艺流程为:工件前处理(除油热水洗除锈冷水洗磷化热水洗钝化)阳极电泳工件后处理(清水洗烘干)。1、除油:溶液一般为热碱性化学除油液,温度为60(蒸汽加热),时间为20min左 右。2、热水洗:温度60(蒸汽加热),时间2min。3、除锈:用H2SO4或HCl,加清洗剂1.5%;室温下洗1020min。4、冷水洗:流动中冷水洗1mi
20、n。5、磷化:用中温磷化(60时磷化10min)。6、钝化:用与磷化液配套的药品,室温下12min即可。7、阳极电泳:电解液成分:H08-1黑色电泳漆,固体分质量分数9%12%,蒸馏水质量分数88%91%。电压:(7010)V;时间:22.5min;漆液温度:1535。8、清水洗:流动冷水中洗。9、烘干:在烘箱中于(1655)温度下烘4060min即可。,Die Casting压铸,Polishing抛光,Process:,ElectropHoresis电泳,3.电泳 Electrophoresis,3.电泳 Electrophoresis,电泳与电镀之比较表,3.电泳 Electrophor
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