电路板制作流程.ppt

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1、,P C BPRESENTATION,P C BPRESENTATION,P C BPRESENTATION,PCB Manufacturing Process Flow,PCB Manufacturing Process Flow,PCB Manufacturing Process Flow,April,20,1999 JOHNNY HSU,流 程 圖 PCB Mfg.FLOW CHART,UPDATED:1999,04,16,顧 客(CUSTOMER),工 程 製 前(FRONT-END DEP.),裁 板(LAMINATE SHEAR),內 層 乾 膜(INNERLAYER IMAGE)

2、,預 疊 板 及 疊 板(LAY-UP),通 孔 電 鍍(P.T.H.),液 態 防 焊(LIQUID S/M),外 觀 檢 查(VISUAL INSPECTION),成 型(FINAL SHAPING),業 務(SALES DEPARTMENT),生 產 管 理(P&M CONTROL),蝕 銅(I/L ETCHING),鑽 孔(PTH DRILLING),壓 合(LAMINATION),外 層 乾 膜(OUTERLAYERIMAGE),二次銅及錫鉛電鍍(PATTERN PLATING),蝕 銅(O/L ETCHING),檢 查(INSPECTION),噴 錫(HOT AIR LEVELIN

3、G),電 測(ELECTRICAL TEST),出 貨 前 檢 查(O Q C),包 裝 出 貨(PACKING&SHIPPING),曝 光(EXPOSURE),壓 膜(LAMINATION),前處理(PRELIMINARY TREATMENT),顯 影(DEVELOPIG),蝕 銅(ETCHING),去 膜(STRIPPING),黑 化 處 理(BLACK OXIDE),烘 烤(BAKING),預 疊 板 及 疊 板(LAY-UP),壓 合(LAMINATION),後處理(POSTTREATMENT),曝 光(EXPOSURE),壓 膜(LAMINATION),二次銅電鍍(PATTERNPL

4、ATING),錫 鉛 電 鍍(T/L PLATING),去 膜(STRIPPING),蝕 銅(ETCHING),剝 錫 鉛(T/L STRIPPING),塗 佈 印 刷(S/M COATING),預 乾 燥(PRE-CURE),曝 光(EXPOSURE),顯 影(DEVELOPING),後 烘 烤(POST CURE),多層板內層流程(INNER LAYER PRODUCT),MLB,全 板 電 鍍(PANEL PLATING),銅 面 防 氧 化 處 理(O S P(Entek Cu 106A),外 層 製 作(OUTER-LAYER),TENTING,PROCESS,鍍 金 手指(G/F

5、PLATING),鍍 化 學 鎳 金(E-less Ni/Au),For O.S.P.,選 擇 性 鍍 鎳 鍍 金(SELECTIVE GOLD),印 文 字(SCREEN LEGEND),網 版 製 作(STENCIL),圖 面(DRAWING),工 作 底 片(WORKING A/W),製 作 規 範(RUN CARD),程 式 帶(PROGRAM),鑽 孔,成 型 機(D.N.C.),底 片(MASTER A/W),磁 片,磁 帶(DISK,M/T),藍 圖(DRAWING),資 料 傳 送(MODEM,FTP),A O I 檢 查(AOI INSPECTION),除 膠 渣(DESME

6、R),通 孔 電 鍍(E-LESS CU),DOUBLE SIDE,前處理(PRELIMINARY TREATMENT),前處理(PRELIMINARY TREATMENT),前處理(PRELIMINARY TREATMENT),全面鍍鎳金(S/G PLATING),雷 射 鑽 孔(LASER ABLATION),Blinded Via,顯 影(DEVELOPIG),P 2,(1)Front-end Process(Tooling),P 3,(2)多 層 板 內 層 製 作 流 程,MLB,DOUBLE SIDE,Blinded Via,P 4,(3)Outer Layer Process F

7、low,P 5,For O.S.P.,(4)Surface Finished&Final Inspection,P 6,Typical PCB Manufacturing Process,1.（基板）THIN CORE,2.（压膜）Dry Film Resist Coat,P 7,Typical PCB Manufacturing Process,4.（显影）Develop,3.（曝光）Expose,P 8,Typical PCB Manufacturing Process,5.（蚀刻）Etch,6.（剥膜）Strip Resist,P 9,Typical PCB Manufacturing

8、Process,7.（叠合）Lay-up,8.（压合）Lamination,P 10,Typical PCB Manufacturing Process,9.（钻孔）Drilling(Primary),10.（PTH&镀铜）PTH&Copper Deposition,P 11,Typical PCB Manufacturing Process,11.（外层压膜）Dry Film Lamination(Outer layer),12.（曝光）Expose,P 12,Typical PCB Manufacturing Process,13.（显影）Develop,14.（镀二铜）Pattern P

9、lating,P 13,Typical PCB Manufacturing Process,15.（镀锡铅）Tin Plating,16.（剥膜）Film Stripping,P 14,Typical PCB Manufacturing Process,15.（蚀刻）Etch,16.（剥锡铅）Tin Stripping,P 15,Typical PCB Manufacturing Process,18.（表面处理）Surface Finished(Electroless Ni/Au,HAL),17.（防焊）Solder Mask(Spray Coating),P 16,Lay-up Struc

10、ture,.,P 17,1.下料裁板 Laminate Shear(Panel Size),2.內層板壓乾膜 Dry Film Resist Coat(Inner Layers),P 18,3.曝光 Expose,4.曝光後 After Expose,P 19,5.內層板顯影 Develop,6.酸性蝕刻 Power/Ground/Signal(Etch),P 20,8.黑化 Oxide Treatment,7.去乾膜 Strip Resist,P 21,9.疊板 Lay-up,P 22,10.壓合 Lamination,11.鑽孔(Drill&Deburr)(P.T.H.&Blind Via

11、),P 23,12.鍍通孔及一次電鍍 Desmear&Copper Deposition,13.外層壓膜 D/F Photo Resist Coat,P 24,14.外層曝光 Expose(Outer-Layer),15.曝光後 After Expose,P 25,16.外層顯影 Develop,17.線路蝕刻(酸性蝕刻)(Etch),P 26,18.去乾膜 Strip Resist,19.防焊 Solder Mask Coat,P 27,20.防焊曝光 Expose,21.顯影 Develop,P 28,22.文字 Legend(Silk Screen),23.噴錫(浸金)HAL,Immersion gold,P 29,Positive-Acting(working),P 30,Negative-Acting(working),Q&A,END,