《封装工艺介绍》PPT课件.ppt

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1、Assembly Process Introduction-Internal Training Material,Zhang Weida2009.5.31,IC Package Basic Introduction;Process Flow of QFPProcess Flow of BGAPackage Summary,Index,IC Package Basic Introduction,Assembly Process Flow,Wafer晶圆Street Width 街区宽度Thickness 厚度Substrate(S/B)基板Leadframe(LF)框架,IC Package B

2、asic Introduction,IC Package Basic Introduction,IC Package Basic Introduction,IC Package Basic Introduction,QFP Process Flow,Back Grounding,Taping,De-taping,Mount,Die Saw(Dicing),Die Bond,Epoxy Cure,Plasma,Wire Bond,Molding,PMC,Mark,D/D,Plating,Trim/Form,FVI,IC Package Basic Introduction,Back Ground

3、ing,Taping,De-taping,Mount,Die Saw(Dicing),Die Bond,Epoxy Cure,Plasma,Wire Bond,Molding,PMC,Mark,Ball Attack,Singulation,FVI,IC Package Basic Introduction,BGA Process Flow,TM2633B92283.1#69852Z,Process Flow of QFP,Process Flow of QFP,Place wafers in the tape frame to facilitate the die saw process.,

4、WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,Process Flow of QFP,Cut wafers into single die unit according to the specific die size.,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGU

5、LATIONPACKING,Process Flow of QFP,Attach dice to the lead frame,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATING FORMING/SINGULATIONPACKING,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULAT

6、IONPACKING,To connect the die pad and the lead frame by gold wire,which makes the die function work when lead frame is connected with outside device.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,To encapsulate th

7、e wire-bonded I.C.to protect the die and gold wire from damage,contamination&oxidation.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,xxxTM2633B92283.1#69852Z,To imprint legend on top side of the product by ink or

8、 laser for Identification of device type.The marking content include logo,lot no.,date code device type and so on.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,175oC,To stabilize the property of plastic package c

9、hemically and physically to ensure the reliability of I.C.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,Dejunk:is to cut/remove the resin between dambars and mold compound.Trim:is to cut dambars of lead frame.,Pr

10、ocess Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,Solder plating is to form a thin film on the lead frame by electrodeposits.This thin solder can ensure the usage of the product and protect the leads from oxidation.,Pro

11、cess Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,To separate finished units on the leadframe stripe into single unit,and them bend the lead of each unit to the specific shape.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE

12、 ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULATIONPACKING,To separate finished units on the leadframe stripe into single unit,and them bend the lead of each unit to the specific shape.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDE

13、JUNK/TRIMSOLDER PLATING FORMING/SINGULATIONPACKING,To separate finished units on the leadframe stripe into single unit,and them bend the lead of each unit to the specific shape.,Process Flow of QFP,WAFER MOUNTWAFER SAWDIE ATTACHWIRE BONDMOLDMARKPOST MOLD CUREDEJUNK/TRIMSOLDER PLATINGFORMING/SINGULAT

14、IONPACKING,Select suitable tube,tray or box for packing in according to product type and customer requirement.,Process Flow of QFP,Process Flow of BGA,Process Flow of BGA,FRONT END 前线,BACK END 后线,BACK GRINDING晶圆背面研磨WAFER SAW晶圆切割DIE BOND上片WIRE BOND焊线,MOLDING塑封(压模)MARKING印字BALL ATTACH植球SINGULATION分离成型

15、LEAD SCAN/FVI外观检查,ASSEMBLY FLOW 组 装 流 程,Process Flow of BGA,WAFER 晶圆,Back Grinding 晶圓背面研磨(减薄),WAFER,TRUCK TABLE,GRINDING WHEEL,Process Flow of BGA,Wafer Saw晶 圆 切 割,WAFER,BLUE TAPE,WAFER MOUNT,SAW BLADE,DIE,Process Flow of BGA,Die Bond(Die Attach)上 片,BOND HEAD,SUBSTRATE,EPOXY,EPOXY CURE(DIE BOND CURE

16、),Process Flow of BGA,Wire Bond焊 线,GOLD WIRE,FINGER(INNER LEAD),DIE,PAD,CAPILLARY,Process Flow of BGA,Molding塑封(压模),Compound,Mold chase,Process Flow of BGA,Marking印字(盖印),INK MARK 油墨印字,LASER MARK 激光印字,Process Flow of BGA,175oC,Post Mold Cure塑封后固化,Process Flow of BGA,Ball Attach植 球,VACUUM,BALL ATTACH TOOL,SOLDER BALL,FLUX,FLUX PRINTING,BALL ATTACH,REFLOW,Process Flow of BGA,Singulation for PBGA切 粒,SAW SINGULATION,ROUTER,PUNCH,Process Flow of BGA,Singulation for FBGA切 粒,Process Flow of BGA,Package Summary,Q&A,