CCM产品工艺知识培知识.ppt

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1、CCM产品工艺知识培训,制作:陈建文日期:,2,产品的应用 产品的类型 产品的构造 产品的制作工艺 问与答 附录:专业名词介绍,3,Part I 产品的应用,4,Part I 产品的应用,拆解,拆解,手机摄像模组,5,Part II 产品的类型,软板定焦模式(FF)1.B-To-B 2.Gold Finger,6,Part II 产品的类型,软板变焦模式 1.手动变焦(MF)2.自动变焦(AF),7,Part II 产品的类型,插槽模式(Socket),8,Part II 产品的类型,像素分类 CIF(352*288)10万像素(0.1M)VGA(640*480)30万像素(0.3M)SXGA

2、(1280*1024)130万像素(1.3M)UXGA(1600*1200)200万像素(2.0M),9,Part III 产品的构造,CSP(Chip Scale Package),10,Part III 产品的构造,COB(Chip On Board),11,Part III 产品的构造,镜头(Lens),镜座(Holder),芯片(Chip),电路板(PCB),连接器(Con.),12,Part III 产品的构造,FPC,13,Part IV 产品的制作工艺,材料 1.晶圆(Wafer)主要是由硅和锗组成,是摄像头模组的核心部分,称之为影像传感器。,14,Part IV 产品的制作工艺

3、,2.线路板 Printed Circuit Board印刷电路板,是电子元器件的支撑体,是电子元器件电气连接的提供者,简称PCB.,15,Part IV 产品的制作工艺,3.镜座(Holder),16,Part IV 产品的制作工艺,4.镜头(Lens),17,Part IV 产品的制作工艺,5.软板(FPC)Flexible Circuit Board软性印制电路是以聚酰亚胺或聚酯薄膜为基材制成的一种具有高度可靠性绝佳的可挠性印刷电路。,18,Part IV 产品的制作工艺,工艺流程,Wafer清洗,Plasma清洗,固晶,固晶烘烤,邦线,金线检查,DAM邦定,DAM烘烤,二流体清洗,CC

4、D检查,Glass贴附,CCD检查,固化,半成品测试,19,dispense,CMOS Chip,dispense,IR Glass,dispense,+,+,+,+,Lens Barrel,20,Part IV 产品的制作工艺,Die Bonding:使芯片 与PCB粘合。注意点：1.芯片方向 2.胶量 3.顶针和吸嘴印 4.芯片角度 5.芯片位置 6.芯片倾斜,21,Part IV 产品的制作工艺,Wire Bonding:通过金线焊接使芯片与PCB线路导通。注意点：1.接线是否正确 2.线弧 3.金球大小 4.金球厚度 5.金线拉力 6.金球推力,22,Solder Paste,Scre

5、en Print,Passive Placement,ForDie Attach,Passive,Solder Paste,Passive,Substrate,23,Die Attach,Wire Bonding,Wet Clean,Chip,SensorArea,Au Wire,Chip,SensorArea,Au Wire,24,IR Glass Mount,IR Glass SAW,WaferRing,IRGlass,IRGlass,25,Glue Dispense,IR Glass Attach,Holder,Holder,Glue,Glue,IR cut Glass,IRGlass,

6、CA800-IR,CA800-IR,26,Glue Dispense,Holder Attach,Glue,Glue,Barrel Insert,Barrel,Holder,CA800-HA,CA800-HA,CA-800-BI,27,Singlation,cut,cut,28,Focus adjust,Barrel,Barrel Fixation,Motor,Lighting（Percolation Method),chart,Achromatic Lens,ND4（Adjustment of Light Quantity）,Laser,29,Part V 问与答,Q&A,30,Part V

7、I 专业名词介绍,31,ENDThanks!,32,Bonding Process,33,pad,lead,Free air ball is captured in the chamfer,34,pad,lead,Free air ball is captured in the chamfer,SEARCH HEIGHT,35,pad,lead,Free air ball is captured in the chamfer,SEARCH SPEED1,SEARCH TOL 1,36,Free air ball is captured in the chamfer,pad,lead,SEARC

8、H SPEED1,SEARCH TOL 1,37,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,38,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,39,Free air ball is captured in the chamfer,pad,lead,SEARCH TOL 1,SEARCH SPEED1,40,Formation of a first bond,pad,lead,

9、SEARCH SPEED1,SEARCH TOL 1,41,Formation of a first bond,pad,lead,SEARCH SPEED1,SEARCH TOL 1,IMPACT FORCE,42,Formation of a first bondContact,pad,lead,heat,PRESSURE,Ultra Sonic Vibration,43,Formation of a first bondBase,pad,lead,Ultra Sonic Vibration,heat,PRESSURE,44,Capillary rises to loop height po

10、sition,pad,lead,45,Capillary rises to loop height position,pad,lead,46,Capillary rises to loop height position,pad,lead,47,Capillary rises to loop height position,pad,lead,48,Capillary rises to loop height position,pad,lead,49,Capillary rises to loop height position,pad,lead,RH,50,Formation of a loo

11、p,pad,lead,RD(Reverse Distance),51,Formation of a loop,pad,lead,52,pad,lead,53,pad,lead,Calculated Wire Length,WIRE CLAMP CLOSE,54,pad,lead,Calculated Wire Length,55,pad,lead,SEARCH DELAY,56,pad,lead,TRAJECTORY,57,pad,lead,TRAJECTORY,58,pad,lead,TRAJECTORY,59,pad,lead,TRAJECTORY,60,pad,lead,TRAJECTO

12、RY,61,pad,lead,TRAJECTORY,62,pad,lead,TRAJECTORY,63,pad,lead,TRAJECTORY,64,pad,lead,TRAJECTORY,65,pad,lead,TRAJECTORY,66,pad,lead,2nd Search Height,Search Speed 2,Search Tol 2,67,pad,lead,Search Speed 2,Search Tol 2,68,pad,lead,Search Speed 2,Search Tol 2,69,Formation of a second bond,pad,lead,heat,

13、70,Formation of a second bondContact,pad,lead,heat,heat,71,pad,lead,heat,heat,Formation of a second bondBase,72,pad,lead,73,pad,lead,74,pad,lead,75,pad,lead,Tail length,76,pad,lead,77,pad,lead,78,pad,lead,Disconnection of the tail,79,pad,lead,Disconnection of the tail,80,pad,lead,Formation of a new free air ball,