双极型器件基本原理.ppt
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1、,Chapter 9 双极型器件(1)9.1 引言9.2 双极型器件概述9.3 直流特性与电流增益(均匀基区晶体管)9.4 直流特性和电流增益(漂移晶体管),9.1 引言,双极型晶体管是一种电流控制器件,电子和空穴同时参与导电。同场效应晶体管相比,双极型晶体管开关速度快,但输入阻抗小,功耗大。双极型晶体管体积小、重量轻、耗电少、寿命长、可靠性高,已广泛用于广播、电视、通信、雷达、计算机、自控装置、电子仪器、家用电器等领域,起放大、振荡、开关等作用。,Historical introduction,The bipolar transistor was invented in 1947 at Be
2、ll labs by Bardeen&Brattain consisting of metal points contacting a germanium substrate.It was later explained by Shockley in 1949 and the three shared the Nobel prize for their work.This tiny triangle of plastic,gold and germanium was the first solid-state amplifier,The first junction bipolar trans
3、istor,Shockley was annoyed that he hadnt been involved in Bardeen&Brattains point contact transistor so he spent New Years eve 1947 in a Chicago hotel room designing an even better device,the junction transistor containing a very thin p-type layer sandwiched between two n-type Ge layers.Electrons in
4、 this device travel through the bulk of the semiconductor rather than across the surface.It was more robust and reproducible than the point-contact device and is the subject of this part,Shockley semiconductorthe first to settle in Palo Alto Silicon Valley,Modern devices,Modern bipolar transistors(s
5、o called as both holes and electrons participate in the conduction)are based on silicon substrates with two closely coupled p-n junctions.,氧化物隔离的npn管横截面图,发射区、基区和集电区的典型掺杂浓度为1019,1017,1015 cm-3 BJT是非对称器件,原理,The goal of a transistor is to use a small input to control a large output e.g.a small input si
6、gnal to be amplified.,A bipolar transistor controls the flow of current through the device by using the base current to modify the potential profile in the channellike water flowing over a bump in the ground,希望尽可能多的电子能到达集电区而不和基区中的多子空穴复合,半导体器件原理,南京大学,电压控制器件(MOSFET)利用加在栅极与源极之间的电压来控制输出电流。饱和区工作电流IDSS会随V
7、GS而改变。电流控制器件(BJT)利用基极电流控制集电极电流。,晶体管的分类:双极型晶体管(少子与多子参与导电)单极型晶体管(电流由多数载流子输运),半导体器件原理,南京大学,9.2 双极型器件概述1.基本结构:发射极(E),基极(B)和集电极(C),均匀基区杂质分布及非均匀基区杂质分布,半导体器件原理,南京大学,半导体器件原理,南京大学,一、发射区向基区注入电子 由于e结正偏,因而结两侧多子的扩散占优势,这时发射区电子源源不断地越过e结注入到基区,形成电子注入电流IEN。与此同时,基区空穴也向发射区注入,形成空穴注入电流IEP。因为发射区相对基区是重掺杂,基区空穴浓度远低于发射区的电子浓度,
8、所以满足 IEP IEN,可忽略不计。因此,发射极电流IEIEN,其方向与电子注入方向相反。,二、电子在基区中边扩散边复合注入基区的电子,成为基区中的非平衡少子,它在e结处浓度最大,而在c结处浓度最小(因c结反偏,电子浓度近似为零)。因此,在基区中形成了非平衡电子的浓度差。在该浓度差作用下,注入基区的电子将继续向c结扩散。在扩散过程中,非平衡电子会与基区中的空穴相遇,使部分电子因复合而失去。但由于基区很薄且空穴浓度又低,所以被复合的电子数极少,而绝大部分电子都能扩散到c结边沿。基区中与电子复合的空穴由 基极电源提供,形成 基区复合电流IBN,它是基极电流IB的 主要部分。,三、扩散到集电结的电
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