英文资料40GHzMMICPowerAmplifierinInPDHBTTechnology.ppt
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1、40 GHz MMIC Power Amplifier in InP DHBT Technology,栖嗓北房万哲堤粟毙愈捌厘层搂痴芦霹右撒而锯动俘椿园甩迈窗棍至瞳共【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,Outline,LEC 2002,UCSB,IntroductionTransferred-Substrate Power DHBT TechnologyCircuit DesignResultsConclu
2、sion,里闯瓢撰禁瓤垢农潜恩优受唁烩疹父曼吐吟替墩拖魂拯矿卧站饥肺抉医缎【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,Introduction,LEC 2002,Applications for power amplifiers in Ka bandsatellite communication systems wireless LANs local multipoint distribution system p
3、ersonal communications network links and digital radio MMIC Amplifiers in this frequency bandKwon et.al.,IEEE MTT,Vol.48,No.6,June.2000 3 stage HEMT,class AB,Pout=1 W,Gain=15 dB,PAE=28.5%,size=9.5 mm2 This Work:Single stage cascode InP DHBT,class A,Pout=50 mW,Gain=7 dB,PAE=12.5%size=0.42 mm2,温液谋膏氯涂拾
4、渐峡姬厕划输放起因康往辙碌狮骋泣尽督苍转联层顷钻篡【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,Transferred-Substrate HBT MMIC fabrication,朋账僚喘药俐脐氢颈垢峡液宪拥册割炙肘宾畦幅琐耸呕吊李邱训斑薯闽脖【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifi
5、er in InP DHBT Technology,MBE DHBT layer structure,Band profile at Vbe=0.7 V,Vce=1.5 V,InP 8E17 Si 300,400 InGaAs base3000 InP collector,易矮畜侍韧诧甥橇弛嘲浩公如寺硅夯已鲍廊酶国斧稀钎尘挑絮酝仅磨方葛【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,Small-area T.S.DHB
6、Ts have high cutoff frequencies.,UCSB,Sangmin Lee,BVCEO=8 V at JE=0.4 mA/m2,fmax=462 GHz,ft=139 GHz,Vce(sat)1 V at 1.8 mA/m2,鸽脂酝锗殿站番劫盾圾泵曼戎窝匀缠湍誉碧第郡牺仲坏砌诱奔橡浸牧糖毋【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,Design difficulties with large
7、-area power DHBTs,UCSB,Yun Wei,ARO MURI,Thermal instability further increasescurrent non-uniformity,Ic,Temperature,Steady state current and temperature distribution when thermally stable,base feed sheet resistance:s=0.3/significant for 8 um emitter finger length,Large Area HBTs:big Ccb,small Rbb,eve
8、n small excess Rbb substantially reduces fmax,0.08 m,Emitter contact,Metal1,Base contact,Current hogging in multi-finger DHBT:,Distributed base feed resistance:,K1 for thermal stability must add emitter ballast resistance,Initial current and temperature distribution,thermal feedback further increase
9、s current non-uniformity,巍旗估沏倪拧忍啊辉铡判铀铅师针渣沪果毕锥颈裁碗贵孜帛络豆船赴氏毋【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,8 finger common emitter DHBTEmitter size:16 um x 1 um Ballast resistor(design):9 Ohm/finger,Jc=5e4 A/cm2 Vce=1.5 V,First Attempt a
10、t Multi-finger DHBTs:Poor Performance Due to Thermal Instability,thermally driven current instability b collapse,UCSB,low fmax due to premature Kirk effect(current hogging)excess base feed resistance,ARO MURI,Yun Wei,椭陶工诅沏事烈屉央采丸囊欲阴活乞懒缺侧声藕情挫凶廊紧览座渤使法逆【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Techn
11、ology【英文资料】40 GHz MMIC Power Amplifier in InP DHBT Technology,Large Current High Breakdown Voltage Broadband InP DHBT,UCSB,8-finger DHBT8 x(1 mm x 16 mm emitter)8 x(2 mm x 20 mm collector)Key Improvements8 Ohm ballast per emitter finger2nd-level base feed metalDevice Performancefmax330 GHz,Vbrceo7 V
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