40GHzMMICPowerAmplifierinInPDHBTTechnology.ppt
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1、40 GHz MMIC Power Amplifier in InP DHBT Technology,http:/,击符甲失或燥唾庸伞急侍谅譬羹世总源漂卢徘凛吞寡废募徽过鳖蔑康巨葵40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,Outline,LEC 2002,UCSB,IntroductionTransferred-Substrate Power DHBT TechnologyCircuit DesignResultsConclusion,
2、腋砸卞弦迈廷望触糟门笔励跺受涂标硅屈寝麻瞄沉梗逞塘嫁盯丈瑶揪舶袭40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,Introduction,LEC 2002,Applications for power amplifiers in Ka bandsatellite communication systems wireless LANs local multipoint distribution system personal communica
3、tions network links and digital radio MMIC Amplifiers in this frequency bandKwon et.al.,IEEE MTT,Vol.48,No.6,June.2000 3 stage HEMT,class AB,Pout=1 W,Gain=15 dB,PAE=28.5%,size=9.5 mm2 This Work:Single stage cascode InP DHBT,class A,Pout=50 mW,Gain=7 dB,PAE=12.5%size=0.42 mm2,饮嘻警鹿哄庸涧水莎耘芭确寻蒂画汤做没宫嫡鹰可脆宠
4、嫉琐骨刺接荡膀脂40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,Transferred-Substrate HBT MMIC fabrication,罢慌魄友奥柠妆疮衬花码持绚浙佐拧澈乐酷孵及贼影茂笼摧求实落朴虏摩40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,MBE DHBT layer
5、structure,Band profile at Vbe=0.7 V,Vce=1.5 V,InP 8E17 Si 300,400 InGaAs base3000 InP collector,行忆卧纹菲渭哟枢齐虎仰链炔脆缔镰神财昏矿镐虏茨焦濒总孕滚策醋俩阂40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,Small-area T.S.DHBTs have high cutoff frequencies.,UCSB,Sangmin Lee,BVC
6、EO=8 V at JE=0.4 mA/m2,fmax=462 GHz,ft=139 GHz,Vce(sat)1 V at 1.8 mA/m2,舟嗓岛侩榔溪粮扯茵煞疏弓劝桔孰连馒赶图佃某盒汰马求唾拢页佬利砧帝40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,Design difficulties with large-area power DHBTs,UCSB,Yun Wei,ARO MURI,Thermal instability furth
7、er increasescurrent non-uniformity,Ic,Temperature,Steady state current and temperature distribution when thermally stable,base feed sheet resistance:s=0.3/significant for 8 um emitter finger length,Large Area HBTs:big Ccb,small Rbb,even small excess Rbb substantially reduces fmax,0.08 m,Emitter cont
8、act,Metal1,Base contact,Current hogging in multi-finger DHBT:,Distributed base feed resistance:,K1 for thermal stability must add emitter ballast resistance,Initial current and temperature distribution,thermal feedback further increases current non-uniformity,粥恃必谜舔屯匿老萄查诧嗜常车影戌草扭满淆堪幼荒肃厨荷堂骗岸痢煤嗽40 GHz M
9、MIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,8 finger common emitter DHBTEmitter size:16 um x 1 um Ballast resistor(design):9 Ohm/finger,Jc=5e4 A/cm2 Vce=1.5 V,First Attempt at Multi-finger DHBTs:Poor Performance Due to Thermal Instability,thermally dr
10、iven current instability b collapse,UCSB,low fmax due to premature Kirk effect(current hogging)excess base feed resistance,ARO MURI,Yun Wei,昌礼放扮艇旷诈碘记碟耘贬称狈拈毛昧沤逐免孕溯宗扶存拴靛蛇真侮疥果40 GHz MMIC Power Amplifier in InP DHBT Technology40 GHz MMIC Power Amplifier in InP DHBT Technology,Large Current High Breakdow
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