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1、2023/3/10,杜邦产品介绍,杜邦产品介绍,杜邦产品介绍,簡報大綱,軟性電路板基材之介紹基材的主要CompositionDielectric Substrates(絕緣體)Adhesive(膠質)Conductor(導體),m,杜邦产品介绍,簡報大綱(continue),杜邦產品壓克力膠系列(Modified WA Acrylic)之基材環亞樹脂膠系列(Modified Epoxy)之基材杜邦 料號解說PyraluxTelcam,m,杜邦产品介绍,軟性電路板之主要基材,Copper Clad Laminates(銅箔基材)Single-Sided C.C.L.(單面銅箔基材),Adhesi
2、ve,Conductor,Dielectric Substrate,m,杜邦产品介绍,Double-Sided C.C.L.(雙面銅箔基材),Conductor,Dielectric Substrate,Adhesive,軟性電路板之主要基材,m,杜邦产品介绍,Adhesive-Less C.C.L.(無膠銅箔基材),Dielectric Substrate,Conductor,軟性電路板之主要基材,m,杜邦产品介绍,Coverlay(覆蓋膜),軟性電路板之主要基材,m,杜邦产品介绍,Stiffner(補強材),軟性電路板之主要基材,Dielectric Substrate,Adhesive,
3、m,杜邦产品介绍,Bondply,Dielectric Substrate,Adhesive,Adhesive,軟性電路板之主要基材,m,Mylar,Adhesive,Kapton,Adhesive,杜邦产品介绍,Sheet AdhesivePhotoImageable Coverlay(PIC)Dry FilmFine-Line ApplicationCameraAutomotiveOthers,軟性電路板之主要基材,m,杜邦产品介绍,Dielectric Substrates,DefinitionA base film on which the printed conductors are
4、 laid.A film which provides electrical insulation between conductors.A film which provides mechanical strength of the circuit.,m,杜邦产品介绍,必備之特性Mechanical StrengthFlexibilityDimensional StabilityDielectric PropertiesThermal PropertiesChemical ResistanceMoisture AbsorptionCost,Dielectric Substrates,m,杜邦
5、产品介绍,Substrates 之種類PolyimidePolyesterFluorocarbonAramid PaperComposite,Dielectric Substrates,m,杜邦产品介绍,Polyimide:Popularized by DuPont under“Kapton”Also known as PI First choice of film in most FPCInfusible and flame retardantHigh Tg(約 260C-280C)Good dimensional stability,Substrates,m,杜邦产品介绍,Substrat
6、es,Polyester:Popularized by DuPont under“Mylar”Also known as PETLowest cost dielectric materialMostly used in low-cost consumer applicationGood mechanical propertiesBad thermal properties,m,杜邦产品介绍,Substrates,Aramid Paper:Sold under DuPont trade name“Nomex”Used in specialized applicationGood thermal
7、insulation material,m,杜邦产品介绍,Property Polyester Polyimide Fluorocarbon Aramid Paper Composite,Tensile Strength Excellent Excellent Fair Good Best,Flexibility Excellent Excellent Excellent Good Fair/Good,Dim.Stability Fair/Good Good Fair Good Fair/Good,Dielectric Str.Good Good Very Good Very Good Goo
8、d,Solderibility Poor Excellent Fair Excellent Excellent,C.O.T.(C)105 200-230 150-180 220 105-180,Thermal Exp.Low Low High Moderate Low,Chem.Resist.Good Good Excellent Very Good Fair,Moisture Absorp.Very Low High Very Low Very High Low,Cost Low High High Moderate Moderate,Trade Name Mylar Kapton Tefl
9、on/Tedlar Nomex,Dielectric Substrates,m,杜邦产品介绍,Adhesive,DefinitionMaterial that bonds layers togetherThermosettingThermoplastic,m,杜邦产品介绍,Adhesive,必備之特性Adhesion StrengthFlexibilityChemical ResistanceThermal ResistanceMoisture AbsorptionElectrical PropertiesCost,m,杜邦产品介绍,Adhesive,Adhesive之種類PolyesterA
10、crylicEpoxyPolyimideButyral Phenolic,m,杜邦产品介绍,Adhesive,Polyester:Used where the dielectric is also polyesterUsed where no soldering is neededTypical application:Instant camera film interconnectsInstrument cluster connection in automobiles,m,杜邦产品介绍,Adhesive,Acrylic:Used in demanding temperature requi
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