Infineon产品介绍资料.ppt

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1、Infineon IGBT-Smart Choice in Home Appliance,Jimmy Wang(王 进)Infineon technologies ChinaSystem application engineerJimmy.W,New IGBT family optimized for home appliance,2023/2/13,Contents,Infineon new high speed3 IGBT,Aircon split system with Infineon high speed3&RC-drives IGBT,IGBT overview,2023/2/13

2、,Contents,Infineon new high speed3 IGBT,Aircon split system with Infineon high speed3&RC-drives IGBT,IGBT overview,2023/2/13,Discrete IGBTs ApplicationsWhite goods&consumer Drives 白家电，消费驱动类Washing machines洗衣机Vacuum cleaners吸尘器Air Conditioners空调Refrigerators电冰箱Dishwashers洗碟机Inductive cooking电磁炉Low po

3、wer industrial drives 低功率工业驱动Escalators,Elevators电梯Industrial robots工业机器手Air handling,Fans风扇Pumps泵Sewing machines缝纫机UPS systems and power supplies UPS 电源Solar inverters太阳能逆变WeldingAutomotive汽车,Discrete IGBTs-Applications,InverterDrivenApplications,2023/2/13,Application frequency is the main selectio

4、n criteria of IGBT,IGBT-Where to use.Difference between IGBT,MOSFET and Bipolar Transistor,Frequency,Application Requirements,Ultra high(150 kHz),low,high,low 12 kHz,medium 40 kHz,Bipolar Transistor,MOSFET,IGBT,high 150kHz,Difference IGBT vs.MOSFET:smaller chip size-lower price softer switching,lowe

5、r EMI temperature stable-no significant losses increase increasing Ta/Tj not suitable for ultra high frequencies,Diff.IGBT vs.Bipolar:higher ruggedness(short circuit,avalanche)easier design less passive devices needed in system-lower system cost at same low VCEsat,2023/2/13,IGBT comparing MOSFET,Add

6、itional P+layer,MOSFET,IGBT,2023/2/13,Contents,Infineon new high speed3 IGBT,Aircon split system with Infineon high speed3&RC-drives IGBT,IGBT overview,2023/2/13,The IGBT is basically the preferred device for higher currents at limited pulse frequencies.,VCE,Technological BackgroundDifference betwee

7、n IGBT and MOSFET,Conducting,Switching,2023/2/13,Technological background:TrenchStopTM,TrenchStopTM is the common technology base of new IGBT families from Infineon,2023/2/13,The key to IGBT performance is the carrier profile engineering,Technological background:Tuning IGBT performance,RuggednessEMI

8、,2023/2/13,Competitor landscape,Applikationsbewertung,2023/2/13,600V High speed 3 IGBT product family,20A,Single IGBT,30A,TO-247,TO-220,DuoPack,20A,30A,50A,IGP20N60H3,IGP30N60H3,IKW20N60H3,IKW30N60H3,IKW40N60H3,40A,IGW50N60H3,IGW40N60H3,40A,15A,15A,25A,Devices are fully released,25A,IGB20N60H3*,IGB3

9、0N60H3*,TO-263,IKB20N60H3*,IKB30N60H3*,IKP20N60H3*,IKP20N60H3*,IKW50N60H3*,50A,75A,IKW75N60H3*,*Engineering samples October 2010,2023/2/13,High speed 3 IGBT technologyswitching waveform,Elimination of tail current at high temperature,for MOSFET-like switchingbehavior,2023/2/13,Diode selection:exampl

10、e of Turn-on Waveforms showing benefit of SiC diode,Ic=20A,Vdc=400V,Rgon=10 Ohm,Tj=150C,SiC Diode provides 50%lower Eon losses of IGBT compared to Emcon3 diodeBased on requirements of target applications,the Emcon3 with the rated current of IGBT was selected for the final products,Si Diode,SiC Diode

11、,2023/2/13,PFC in-circuit test,Continuos Current Mode PFCVin=115 230VPout=0-900W 60kHzPout=0-600W 100kHzBoost inductor L=1mHClip mounting+Capton Foil for HeatSink insulationHeatsink Temp.Control=40C,2023/2/13,HighSpeed3 best result at light load,-0.15%at full load,+0.1%,-0.15%,Efficiency ComparisonF

12、s=60kHz,30A IGBTs in TO247,2023/2/13,HighSpeed3+1.1%at light load,-0.15%at full load,+1.1%!,-0.15%,30A IGBTs in TO247,Efficiency Comparison(cont)Fs=100kHz,2023/2/13,Turn-off Waveform comparison 115Vin,Pout=500W,60kHz,IKW30N60H3,IGBT Best competitor,Smooth switching waveforms Low dV/dt and dI/dt for

13、reduced EMI,Ic=5A,Vce=400V,Vge=+15/0V,2023/2/13,Case temperature comparison,Lower case temperature both at 60 and 100 kHz for improved realibility and less cooling requirementsTjmax=175C for Infineon IGBT,Dt=13C,2023/2/13,Rg reduction and EMI considerations,IFX devices show lower dV/dt during turn-o

14、n and turn-offRg can be reduced from 33 Ohm to 7 Ohm still maintaining same or lower dV/dt and hence good EMI behaviour,IGBT with FullPAK Base on High Speed3 Techology,The new 30A IGBT FullPAK will be release soon.Benefit of FullPakMany customers like this package because of the easier mounting proc

15、essThe mounting process does not need any insulating foil and bushing,thus providing cost saving and better reliability,2023/2/13,Launched H2.2010,2023/2/13,Summary,Infineon new High Speed3 IGBTs offer:Reduced switching losses without penalty of high conduction lossesTemperature stable behaviourSmoo

16、th switching waveforms allow to redeuce Rg and EMI.Easy paralleling(where required)Best-in-class devices for improved power densities in Solar,UPS,Welding,SMPS applications,2023/2/13,Contents,Infineon new high speed3 IGBT,Aircon split system with Infineon high speed3&RC-drives IGBT,IGBT overview,202

17、3/2/13,New Innovation Reverse Conducting Technology for Drives,RC-Drives:Infineon now offers the free wheeling diode monolithically integrated into the TRENCHSTOP IGBT-die for hard switching applicationsSame DC current rating of diode and IGBTThis leads to current classes 15A being available in new

18、package classes.,2023/2/13,How to improve the standard IGBT-technology?,Infineons TrenchStop-Technology meets today tomorrows requirements,Introduction of trench gate technology reduces VCE(sat)further Reduction of Conduction Losses for higher Efficiency,2023/2/13,Innovation Breakthrough-Monolithica

19、lly Integrated Diode,Key differentiators4A,6A,10A and 15A devices now available in IPAK or DPAKMajor price advantageSpace savingLowest Vce(sat)for low conduction losses Tj(max)=175C,DPAK,DPAK,Additional featuresWide range of turn-off/-on time controllability via gate resistorVery good EMI behaviour

20、thanks to smooth switching5 us Short Circuit capability,2023/2/13,600V Product Family TRENCHSTOP DuoPack&RC-Drives,6A,IGP06N60T,10A,IGP10N60T,15A,IGB15N60T,IGP15N60T,20A,Single IGBT,30A,IGB30N60T,IGP30N60T,IGW30N60T,TO-247,TO-263,TO-220,TO-220FULL-PAK,IKW20N60T,IKP04N60T,IKB06N60T,IKP06N60T,IKB10N60

21、T,IKP10N60T,IKB15N60T,IKP15N60T,DuoPack,IKW30N60T,IKA06N60T,30A,(D-PAK),IKA10N60T,IKB20N60T,IKP20N60T,IKA15N60T,IKW50N60T,IKW75N60T,50A,75A,IGW50N60T,IGW75N60T,50A,IGB50N60T,IGP50N60T,TO-251,(I-PAK),TO-252,(D-PAK),TO-262,IKI04N60T,IGB10N60T,Comprehensive portfolio for hard switching applications,4A,

22、6A,10A,15A,20A,75A,IKU04N60R,IKU06N60R,IKU10N60R,IKU15N60R,IKD04N60R,IKD06N60R,IKD10N60R,IKD15N60R,2023/2/13,Parameters of RC-Drives,Product Specifications,Power Density increase,2023/2/13,Example of Inverter Size OptimizationDPak vs D2PAK,DPAK needs 1/3 board size of D2PAK,2023/2/13,RC-DrivesMajor

23、Customer Benefits,PriceIn combination with driver IC-discrete solution cheaper than IPM SpacePCB size reductionIncreased flexibility of PCB layoutPerformanceVce(sat)optimised and best Eoff balanced for low lossesSoft switching for low EMI levelsExcellent thermal behaviour with copper layer design Tj

24、(max)of 175C,2023/2/13,Contents,Infineon new high speed3 IGBT,Aircon split system with Infineon high speed3&RC-drives IGBT,IGBT overview,2023/2/13,Aircon split system,A Dual motor kit reference design was developed both in surface mount and straight leads version of RC-Drives:,15A RC-Drives Ipak,15A

25、 RC-Drives Dpak,4A RC-Drives Dpak,6ED gate driver,2023/2/13,Dual motor kit for 1 kW Aircon Split systems:,Compressor stage 1 kW with 6-channel EICEDRIVER and 15A RC-Drives IGBTs in D-PAK,Fan stage 200W with 6-channel EICEDRIVER and 4A RC-Drives IGBTs in D-PAK,PFC switch with High speed 3 IGBT and Em

26、con boost diode,XC165 16Bit MCU card,Aircon split system,2023/2/13,Aircon split system:compressor inverter D-pak version,Inverter with 15ADpak IGBTs is powered to drive an 1.5 kW AC motor+brake system,By adjusting DC brake and motor speed different output powers are achieved The case temperature is

27、monitored for different power levels with an IR camera after steady state conditions,AC Motor,DC Brake,Power meter,IR camera,2023/2/13,A plastic shield is added to avoid any air flow from the rotating shaft of the motor may hit the Heatsink,Aircon split system:compressor inverter D-pak version,2023/

28、2/13,Aircon split system:compressor inverter D-pak version,759 W Output Tc,max=66.7 C,2023/2/13,Aircon split system:compressor inverter D-pak version,1066 W Output Tc,max=84.5 C,2023/2/13,1217 W Output Tc,max=99.4 C,Aircon split system:compressor inverter D-pak version,2023/2/13,Aircon split system:

29、compressor inverter D-pak version,1225 W Output Tc,max=84.5 C,Shield removed Slight air flow present,2023/2/13,Aircon split system:compressor inverter D-pak version,With slight air flow,Without Air flow,1.2 kW output power possible without forced air cooling!,2023/2/13,Aircon split system:Outdoor fa

30、n inverter D-pak version,Inverter with 4A Dpak IGBTs is powered to drive a 200W DC motorNo Heatsink,no forced air,By adjusting motor speed different output powers are achievedThe case temperature is monitored for different power levels with an IR camera after steady state conditions,Daikin Outdoor f

31、an,Power meter,IR camera,2023/2/13,202 W Output Tc,max=134.7 C,Very non-uniform temp.distribution,Aircon split system:outdoor fan inverter D-pak,80C,134.7C,DC bus cap,The case temperature is strongly affected by the surroundingsCool“passive component acting as Heatsink,2023/2/13,Aircon split system:

32、effect of thermal convection,134.7 C,124.9 C,-10 C by allowing vertical airflow on the back of the board!,Board flipped 90 C,2023/2/13,Approach to improve thermal part I,Power loss generationPtotal=Pcon+Psw Irms*Vcesat duty cycle/motor type relatedSwitching speed influence much due to cross over bet

33、ween current and voltage,so it can be changed by drive segment.For example,smaller Rg at turn off contribute to less switching loss.Or anti-parallel diode in series with smaller Rg if necessary.Take as an example,Rg from 22 to 10 Ohm contribute 0.1W less loss per switch on 60W DC fan at 16KHz.fsw:pr

34、oportional to Psw,lower fsw the better,while need to consider not to introduce audio noise.Control scheme,e.g.more conduction time at one leg;sensorless FOC control using XC878,2023/2/13,Approach to improve thermal part II,Thermal dissipationT=Ptotal*RthjaLayout designEnlarge area of copper under de

35、vice as much as possible.More thickness of copper layer,e,g from 1Oz to 2Oz.Put copper layer at both side,meanwhile thermal vias developed in between.the higher density the better Heatsink attached,2023/2/13,10.02.2010,Page 46,Copyright Infineon Technologies 2010.All rights reserved.,Thermal Concept

36、,Thermal Concept for Sections(1.Compressor-Inverter,2.PFC and 3.Fan-Inverter)Optimized for lowest PCB-space usage and cost,PCB,Thermal-Vias,Copper,Isolation Foil,Heatsink,RC-Drives,2023/2/13,10.02.2010,Page 47,Copyright Infineon Technologies 2010.All rights reserved.,PCB manufacturing,Concept can fo

37、llow several methodsCopper inlays(production limited and quite expensive concept).Thermal Vias filled with synthetic resin to avoid solder voids at RC-Drives Leadframe due to a flow through the vias.Small drill holes(below 0.2 mm)for the thermal vias that are filled during galvanisiation to avoid so

38、lder flow.Infineon recommend the small drill hole concepts since its the most cost effective solution due to easy production and adequate thermal behaviour.,Copper Inlays(Ruwel GmbH),Classical Thermal Vias with resin,Thin-Via-Concept(Small drill holes),2023/2/13,10.02.2010,Page 48,Copyright Infineon

39、 Technologies 2010.All rights reserved.,Thermal conciderations of Thin-Via-Concept,Small drill holes Board-Parameter:d=1 mm,r2=0.22 mm,r1=0.2 mm,lamda=400W/KRth,via=95 K/WThe distance between the pads can be zero to have an optimized heatspreading.,2023/2/13,10.02.2010,Page 49,Copyright Infineon Tec

40、hnologies 2010.All rights reserved.,Thermal Concept,15 A RCDThe concept was tested successfully in the demoboard with Tj 150C at Pinv=1.5kW,2023/2/13,Example Surface Mount:Dpak,Commercial Fridge Compressor board,RC-Drives Demoboard,D-pak,D2-pak,Board is flipped upside down and screwed to the Metal s

41、heet“,acting as Heatsink and ground connection,2023/2/13,Thermal VIAS for improved heat dissipation in case a HS is used,Surface Mount,Example of Heatsink mounting,2023/2/13,Vertical insertion:I-pak,Insulation foil+Clips mounting with nuts and bolts.,Washing machine board,2023/2/13,Summary,Infineon

42、solution offer:Best-in-class devices for room saving,improved power densityHigh performance&price ratioVce(sat)optimised and best Eoff balanced for low lossesTemperature stable behaviourSmooth switching waveforms to improve your EMI performance.,2023/2/13,I K D 04 N 60 R,S=SiemensI=Infineon,DeviceD=

43、DiodeK=hardswitching series integrated diodeH=softswitching series integrated diodeG=single diode,Package typeA=TO-220 FullPAKB=TO-263H=TO-220“real two leg”D=TO-252(D-PAK)P=TO-220I=TO-262(I-PAK)U=TO-251(I-PAK)W=TO-247Y=TO-247HC,Infineon IGBT Nomenclature,Voltage(V/10)Breakdown voltage,TechnologyN=N-

44、channelP=P-channelT=Trenchstop(only 1200V)E=Emitter controlled DiodeS=SiC diode,Current class(A)Nominal current 100C,SpecificationsNothing stated=Fast IGBT(20kHz/IGBT2)HS=Highspeed(600V)(80kHz/IGBT2)H2=Highspeed 2(1200V)(80kHz/IGBT2)H3=Highspeed 3(1200V)(80kHz/IGBT4)T=TRENCHSTOP(20kHz/IGBT3)T2=TRENCHSTOP 2nd gen.(20kHz/IGBT4/Emcon4)R=Reverse conducting(60kHz/IGBT3)R2=Reverse conducting,2nd gen.(60kHz/IGBT3)R3=Reverse conducting,3rd gen.(60kHz/IGBT3),2023/2/13,