车身控制器BCM设计方案课件.ppt

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1、车身控制器设计方案（中级车）,Mid Range Platform Architecture,MCU,Driver DoorDoor LockWindow Lift,Rear Left DoorDoor LockWindow Lift,Passenger DoorDoor LockWindow Lift,Rear Right DoorDoor LockWindow Lift,Turn Light,Interior Light,Rear Window Defrost,Key,Anti-Alarm,RKE,Sun roof,Keypad,Keypad,MCU,MCU,Mirror,Mirror,T

2、urn Light,Turn Light,Courtesy Light,Courtesy Light,Exterior Light,Power Seat,Wiper/Washer,Power Curtain,Low End BCM,Mid-range System architecture,Body Controller Module,(LIN Master),Passenger Door Module,(LIN Slave),Door Lock,Window Lift,Keypad,Mirror(&Turn Light),Power Seat control,Window Lift Rear

3、 Right,Window Lift Rear Left,RKE,Courtesy lighting,(LIN Slave),Door Lock,Window Lift,Keypad,Courtesy lighting,Front Lighting,Mirror(&Turn Light),Rear Window Defrost,Front wiper&washer,Horn control,Antitheft Alarm,Door Lock,LIN Network,CAN Interface,CAN Network(link to Powertrain),LIN Interface,LIN I

4、nterface,LIN Interface,Rear door,Trunk&Bonnet status,Courtesy lighting,Power Curtain,Driver Door Module,DDM,MC9S08AW32,5V,LM358,ULQ2003,ULQ2003,Input Condition,SunroofRelay,Current Sensor,Mirror Relay,Mirror Driver,Turn Light Relay,Interior Light Driver,LIN SBC,Blue:LEYellow:MR,Window Motor Current*

5、2,Driver Door(&rear door)Block Diagram,Mirror Defrost,Courtesy Light*2(feet,courtesysigning),Window Motor*2,Rear Window Disable,Door Ajar Status 2,Door Lock Switch*2,Ground,MC9S08AW32,Power Supply,LINSBC,+12V,Digital Input,AnalogInput,RelayDrive,LIN,LIN,Window Switch*8,2,2,4,2,Door Lock*2,Turn Light

6、,1,4,16,20,Mirror Switch*7,Mirror,Folding,2,2,Relays are located inside,PDM,MC9S08AW32,LM358,ULQ2003,ULQ2003,Input Condition,SunroofRelay,Current Sensor,Mirror Relay,Mirror Driver,Turn Light Relay,Interior Light Driver,Blue:LEYellow:MR,5V,LIN SBC,Window Motor Current*2,Passenger Door(&rear door)Bloc

7、k Diagram,Mirror Defrost,Window Motor*2,Rear Window Disable,Door Ajar Status 2,Door Lock Switch*2,Ground,MC9S08AW32,Power Supply,5VSBC,+12V,Digital Input,AnalogInput,RelayDrive,LIN,LIN,Window Switch*4,2,2,4,2,Door Lock*2,Turn Light,1,4,16,8,Mirror Switch*7,Mirror,Folding,2,2,Relays are located insid

8、e,Courtesy Light*2(feet,courtesy,signing),BCM,MC9S08AW32,5V,LM358,ULQ2003,ULQ2003,Input Condition,SunroofRelay,Current Sensor,Turn Light Relay,Interior Light Driver,LIN SBC,MC9S12C32,CAN,ULQ2003,Wiper Relay,Horn Relay,Defrost Relay,Blue:LEYellow:MR,Siren/Horn,Central Body Controller Block Diagram Re

9、lay Solution,Defrost and power curtain,Interior Light(roof,map,glove,head reading,key hole),Seat Motor*4,Power Seat Switch*8,Exterior Light Switch*12,Key Status*4,Ground,MC9S12C/Q32,Power Supply,5V,+12V,Digital Input,AnalogInput,RKEReceiver,RelayDriveMC33291L,LEDDriver,Siren(Relay),LIN,CAN,K,LIN,CAN

10、,K Line,Trunk&bonnet status,Sunroof Switch*2,3,Sunroof Motor Sensor,5,Rear Window Defrost Switch,6,5,9,Exterior Light,Front/Rear Wiper,Front Washer,6,Antitheft LED,Sunroof Motor,2,27,38,Buzzer,Buzzer,Power Seat Motor Current*4,Interior Light Switch,Wiper,Washer Switch*5,High beam:1Low beam:1Tail,Lic

11、ense:1Turn Light:2Fog:2Reverse Light:1Brake Light:1,Power Curtain*2,Key Lock Solenoid,Horn,Antitheft Siren Detection,3,Mid-Range Platform with analog IC,MC9S12C32,MC33661LIN,MC33388CAN,MC33972Switch Detection,MC33972Switch Detection,MC332862*6A,Reverse Light(2*21)W,MC332882*8A,Turn Light(2*21+5)W,Tu

12、rn Light(2*21+5)W,MC338882*10A2*5A8*0.5A,Brake Light(2*21+10)W,High Beam(2*55)W,Tail&License Light(6*5)W,Rear Fog Light(2*21)W,Relays,Low Beam(2*55W),Front Fog Light(2*55W),Rear Window Defrost,Front Wiper low speed,Front Washer,Rear Wiper,Interior Light,Front Wiper high speed,2*ULQ2003,Relays,Power

13、Seat Relay*5,Power curtain*2,Sunroof*2,Horn,Mid Range Platform Architecture with IDC,MCU,Turn Light,Interior Light,Rear Window Defrost,Key,Anti-Alarm,RKE,Sun roof,Exterior Light,Power Seat,Wiper/Washer,Power Curtain,Mirror-Distributed(IDC)Implementation,Intelligent distributed control MM908E621 or M

14、M908E625,Mirror-Distributed(IDC)Implementation,AdvantagesLower number of I/CImproved reliability(lower no of solder joints)Reduced wiring harnessReduced sizeModulePCBDiagnosticsScalable architecture(MM908E625 v MM908E621 Med Hi end solution)Mirror commands made through LINDisadvantagesStill require

15、some added power hardware(heater)Implement power management scheme Need to program and debug node softwareAdded functionality which may not be required for low end systemAdded complexity for module H/W,packaging and validation,Mirror-Centralised Implementation,Power supply andCommunication,Voltage R

16、egulator,CAN Physical layer,Body computerModule BCM,Configurable octal serial switch as Quad H-bridgeMC33880,SPI,Mirror position X-Motor,Single H-bridge,Mirror Fold,Mirror position Y-Motor,D/A,Output driver,Electrochrome,Triple HSD,HeaterSide flasherFoot lamp,6,PWM,1,3,4,STCRTL,STCRTL,Additional INP

17、UTS of the module,Additional OUTPUTS of the module,Mirror switch inputs,Signal conditioning,4,Mirror-Centralised Implementation Pro/Con,AdvantagesFocused implementation for required functionMCU selection optimised for applicationMinimal control latencyDisadvantagesDifficulty in measuring mirror posi

18、tionDiagnostics requires added sophistication of H/W driversIncreased number of wires in harnessHarness routingHarness costDirect switch input required to control the mirror position,Design challenge PCB size,Minimum PCB size:60mmx60mm,High-end EC Mirror Diagram,Module PCB Layout,Number of Power IC:

19、5-7Number of Digital Signal:24,Source:Power IC devices are sampled from 2 major vendors in the industry(excluding Freescale),Design challenge PCB size,40mm,60mm,40mm,60mm,56%Shrink,PCB size:40mmx40mm,56%shrink in size,High-end EC Mirror Diagram,Module PCB Layout,Number of Power IC:1Number of Digital

20、 Signal:2(INT/RST),Mirror implementations Comparison,Window Lift-Distributed Implementation,IDC-MM908E624,Switch inputs,Window lift motor,BEMF detection using internal OPAMP,Window Lift-Distributed Pro/Con,AdvantagesLower number of I/CImproved reliability(lower no of solder joints)Reduced wiring har

21、nessReduced sizeModulePCBDiagnostic Scalable architectureDisadvantagesStill require relays to drive loadNeed to program and debug node softwareAdded functionality which may not be required for low end systemAdded complexity for module H/W,packaging and validation,Window Lift-Centralised control Impl

22、ementation,Power supply andCommunication,Voltage Regulator,CAN Physical layer,Main central bodyMCU,Octal serial switch as Relay driverMC33291L,SPI,Window lift motor,Signal conditioning,Position feedback for Anti-pinch,4,ATD,Additional INPUTS of the module,Additional OUTPUTS of the module,Window swit

23、ch inputs,Signal conditioning,2 I/O,Relay,1,Relay,Window Lift-Centralised control Pro/Con,AdvantagesFocused implementation for required functionLow component costMCU selection optimised for applicationMinimal control latencyDisadvantagesDifficulty in measuring anti-pinch from Central body controller

24、Poor scalabilityNo diagnosticsIncreased number of wires in harnessHarness routingHarness costAdditional H/W required for speed control possibleIncreased MCU functionality for stall detectionControl of multiple windows at same time,Window Lift Comparison,Door lock+Window lift Distributed Implementati

25、on,IDC MM908E624,Switch inputs,Window lift motor,BEMF detection using internal OPAMP,Window lift,Dual low side driver,3,GPIO,H-bridge,Door lock motor,Door lock,Door lock+window lift Distributed Pro/Con,AdvantagesReuse existing Window H/W already in doorReduced wiring harnessReduced sizeModulePCBScal

26、able architectureDisadvantagesStill require relays to drive loadNeed additional relay drivers addedNeed to program and debug node softwareAdded functionality which may not be required for low end systemAdded complexity for module H/W,packaging and validationCommunications over LIN may impact latency

27、 for Passive Entry,Door lock+window lift Centralised Implementation,Power supply andCommunication,Voltage Regulator,CAN or LIN Physical layer,Central bodyMCU,Octal serial switch as Relay driverMC33291L,SPI,Signal conditioning,Position feedback for window Anti-pinch,4,ATD,Additional INPUTS of the mod

28、ule,Additional OUTPUTS of the module,Signal conditioning,2 I/O,Relay,1,Relay,Window lift motor,Window lift switches,Signal conditioning,Door lock switches,2 I/O,H-Bridge,Door lock motor,2 I/O,Door lock+window lift Centralised Pro/Con,AdvantagesOctal serial driver(MC33291)used for all door relay pre-

29、driveFocused implementation for required functionMinimal control latencyDisadvantagesNeed to add discrete relay pre-driver for Boot lockLess scalabilityNo diagnosticsIncreased number of wires in harnessHarness routingHarness cost,Door Lock+Window LiftSleep Current Consumption,Door lock Comparison,Su

30、mmary,RelayMid-Range DDM,PDM can use most of hardware and software of Low end platformLow costNo diagnosis functionIDCModular designCan be easier to upgrade to High end platformFlexibleLow power consumptionLow costAnalogCentralized control with smaller space and more functionsHigh reliabilityExpensi

31、ve,High End Platform Architecture,MCU 9S12C64,Interior Light,Rear Window Defrost,Key,Anti-Alarm,RKE,Sun roof,Mirror,Turn Light,Exterior Light,Power Seat,Wiper/Washer,Power Curtain,Mirror,Turn Light,Power Seat Module,Front Light Module,Rear Light Module,MCU 9S08AW,Seat Motor,Keypad,MCU 9S08AW,Light,M

32、CU 9S08AW,Light,MM908E625Mirror,MM908E625Mirror,MM908E624Door,MM908E624Door,High End Platform Light Control with analog IC,MCU,MC33661LIN,MC33388CAN,MC33972Switch Detection,MC33972Switch Detection,Reverse Light(2*21)W,MC332882*8A,Turn Light 21W,Turn Light 21W,Brake Light(2*21+10)W,High Beam 55W,Tail

33、&License Light(4*5)W,Rear Fog Light(2*21)W,Washer 30W,High Beam 55W,MC332882*8A,Low Beam 55W,Low Beam 55W,MC332882*8A,Fog 55W,Fog 55W,MC331432*3A,MC331432*3A,Tail Light 2*5W,MC332862*6A,MC331432*3A,MC331432*3A,Turn Light 21W,Turn Light 21W,Front Light Module,Rear Light Module,Summary,High End platfo

34、rm has the same architecture as Mid-Range.The light control is a separate moduleThe light module can use analog to implement protection,diagnostic and PWM controlThe power seat is controlled by seat moduleIf using relay,most hardware and software can use low endIf using IDC,the system will be flexible,easy to manufacture and save space.,