英文翻译及文献 电子电子 功率半导体.docx
《英文翻译及文献 电子电子 功率半导体.docx》由会员分享,可在线阅读,更多相关《英文翻译及文献 电子电子 功率半导体.docx(10页珍藏版)》请在三一办公上搜索。
1、New Generation of High Power Semiconductor Closing Switches for Pulsed Power ApplicationsI. Introduction Solid state semiconductor switches are very inviting to use at pulsed power systems because these switches have high reliability, long lifetime, low costs during using, and environmental safety d
2、ue to mercury and lead are absent. Semiconductor switches are able to work in any position, so, it is possible to design systems as for stationary laboratory using, and for mobile using. Therefore these switches are frequently regarded as replacement of gas-discharge devices ignitrons, thyratrons, s
3、park gaps and vacuum switches that generally use now in high-power electrophysical systems including power lasers.Traditional thyristors (SCR) are semiconductor switches mostly using for pulse devices. SCR has small value of forward voltage drop at switch-on state, it has high overload capacity for
4、current, and at last it has relatively low cost value due to the simple bipolar technology. Disadvantage of SCR is observed at switching of current pulses with very high peak value and short duration. Reason of this disadvantage is sufficiently slow process of switch-on state expansion from triggeri
5、ng electrode to external border of p-n junction after triggering pulse applying. This SCR feature is defined SCR using into millisecond range of current switching. Improvement of SCR pulse characteristics can be reached by using of the distributed gate design. This is allowed to decrease the time of
6、 total switch-on and greatly improve SCR switching capacity. Thus, ABB company is expanded the semiconductor switch using up to microsecond range by design of special pulse asymmetric thyristors (ASCR). These devices have distributing gate structure like a GTO. This thyristor design and forced trigg
7、ering mode are obtained the high switching capacity of thyristor (=150kA, =50s, di/dt = 18kA/s, single pulse). However, in this design gate structure is covered large active area of thyristor (more than 50%) that decrease the efficiency of Si using and increase cost of device.Si-thyristors and IGBT
8、have demonstrated high switching characteristics at repetitive mode. However, such devices do not intend for switching of high pulse currents (tens of kiloamperes and more) because of well-known physical limits are existed such as low doping of emitters, short lifetime of minority carriers, small si
9、zes of chips etc.Our investigation have obtained that switches based on reverse switched dinistors are more perspective solid-state switches to switch super high powers at microsecond and submillisecond ranges. Reverse switched dinistors (RSD) is two-electrode analogue of reverse conducting thyristo
10、r with monolithical integrated freewheeling diode in Si. This diode is connected in parallel and in the back direction to the thyristor part of RSD. Triggering of RSD is provided by short pulse of trigger current at brief applying of reversal voltage to RSD. Design of RSD is made thus that triggerin
11、g current passes through diode areas of RSD quasiaxially and uniformly along the Si structure area. This current produces the oncoming injection of charge carriers from both emitter junctions to base regions and initiates the regenerative process of switch-on for RSD thyristor areas. Such method of
12、triggering for this special design of Si plate is provided total and uniform switching of RSD along all active area in the very short time like as diode switch-on. The freewheeling diode integrated into the RSD structure could be used as damping diode at fault mode in the discharge circuit. This fau
13、lt mode such as breakdown of cable lines can lead to oscillating current through switch.It has been experimentally obtained in that semiconductor switches based on RSD can work successfully in the pulsed power systems to drive flash lamps pumping high-power neodymium lasers. It was shown in that RSD
14、-switches based on RSD wafer diameter of 63 mm (switch type KRD-25-100) and RSD-switches based on RSD wafer diameter of 76 mm (switch type KRD-25-180) can switch the current pulses with submillisecond duration and peak value of 120 kA and 180 kA respectively. Three switches (switch type KRD 25-180)
15、connected in parallel were successfully tested under the following mode: operating voltage = 25 kV, operating current Ip = 470 kA, and transferred charge Q = 145 Coulombs.During 2000 2001, the capacitor bank for neodymium laser of facility LUCH was built at RFNC-VNIIEF. This bank including 18 switch
16、es type KRD-25-100 operates successfully during 5 years without any failures of switches.This report is submitted results of development of new generation of solid state switches having low losses of power and high-current switching capacity.II. Development of RSDs next generation The technology of
17、fabrication of new RSD structure has been developed to increase the switching capacity. This new structure is SPT (Soft Punch Through)-structure - with “soft” closing of space-charge region into buffer n-layer.Decreasing of n-base thickness and also improving of RSD switch-on uniformity by good spre
18、ading of charge carriers on the n-layer at voltage inversion are provided decreasing of all components of losses energy such as losses at triggering, losses at transient process of switch-on, and losses at state-on. Our preliminary estimation was shown that such structure must provide the increasing
19、 of operating peak current through RSD approximately in 1.5 times.Investigations were carried out for RSD with blocking voltage of 2.4 kV and Si waferdiameters of 63, 76, and 100 mm by special test station. The main goal of these investigations is definition of maximum permissible level of peak curr
20、ent passing through single RSD with given area. Current passing through RSD and voltage drop on RSD structure during current passing are measured at testing. In Fig.1 waveforms of peak currents and voltage drops is shown for RSD with size of 76 mm and blocking voltage of 2.4 kV.Fig.1. Waveforms of p
21、ulse current (a) and voltage drop (b) for RSD with wafer size of 76 mm and blocking voltage of 2.4 kVIn according with study program current was slowly increased until maximum permissible level Ipm. When this level was reached the sharp rise of voltage and than the same sharp decay of voltage for cu
22、rve U(t) was observed. Reason of voltage rise is strong decreasing of carrier mobility at high temperature, and reason of voltage decay is quick modulation of channel conductivity by thermal generated plasma that is appeared in accordance with sharp exponential dependence for own concentration of in
23、itial silicon into base areas of RSD at temperature of 400 C.Tests were shown that this sharp rise of voltage at maximum permissible current does not lead to immediate fault of RSD. RSD keeps its blocking characteristic. However, after passing of such current we can observe the appearance of erosion
24、 from cathode for aluminum metallization of RSD contacts, and this fact is evidence of borderline state of device. The subsequent increasing of current (more than ) leads to fusing of Si structure. Therefore, level Ipm is the reference position to define the value of operation peak current for RSD-s
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- 英文翻译及文献 电子电子 功率半导体 英文翻译 文献 电子 功率 半导体
链接地址:https://www.31ppt.com/p-2069098.html