PCBA外观检验标准.ppt

,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件X方向)SMD Assembly workmanship criteria-Chip component alignment(X Axis),1.晶片狀零件恰能座落在焊 墊的中央且未發生偏出，所有各金屬封頭都能完全 與焊墊接觸。1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.,1.零件橫向超出焊墊以外，但 尚未大於其零件寬度的50%。(X1/2W)1.The component shifted off the pad and shift length shall less 1/2 chip width,1.零件已橫向超出焊墊，大 於零件寬度的50%(MI)。(X1/2W)1.The component shifted off the pad and shift length over 1/2 chip with,允收狀況(Accept Condition),X1/2W X1/2W,330,X1/2W X1/2W,註:此標準適用於三面或五面 之晶片狀零件This standard only be used for 3 or 5 face terminations chip component,w,w,330,330,理想狀況(Target Condition),拒收狀況(Reject Condition),1.晶片狀零件恰能座落在焊墊 的中央且未發生偏出，所有 各金屬封頭都能完全與焊墊 接觸。1.Component is centered on both sides of the land.All the solder terminations shall completely touch pad.,1.零件縱向偏移，但焊墊尚保 有其零件寬度的25%以上。(Y1 1/4W)2.零件縱向偏移，但零件端電 極仍蓋住焊墊為其零件寬度 的25%以上。(Y2 1/4W)Component is shifted towards longest part of the chip,but the termiuad end of chip still on the land1.The Pad length not be cover by chip(Y1)shall over 1/4 chip width(W)2.1/4 width of the land for solder fillet to form.,1.零件縱向偏移，但焊墊未 保有其零件寬度的25%(MI)。(Y11/4W)2.零件縱向偏移，但零件端 電極蓋住焊墊小於其零件 寬度的25%。(Y21/4W)3.Whichever is rejected.,允收狀況(Accept Condition),W W,330,330,Y2 1/4W,330,Y1 1/4W,Y2 1/4W,Y1 1/4W,SMT零件組裝工藝標準-晶片狀(Chip)零件之對準度(組件Y方向)SMD Assembly workmanship criteria-Chip component alignment(Y Axis),理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-圓筒形（Cylinder）零件之對準度SMD Assembly workmanship criteria-Cylinder component alignment,1.組件的接觸點在焊墊中心1.The point of contact is centered on the lands,1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以下。(X 1/3D)2.零件縱向偏移，但金屬封頭仍在焊墊上。(Y10 mil),(Y20 mil)1.The length of component shifted off the pad(X)shall less the 1/3 Diameter of component2.Shifted toward the longest part of the component,the solder terminations still on the land,1.組件端寬(短邊)突出焊墊端 部份是組件端直徑33%以上(MI)。(X1/3D)2.零件縱向偏移，但金屬封頭未 在焊墊上。(Y10 mil),(Y20 mil)3.Whichever is rejected.,允收狀況(Accept Condition),X1/3D X1/3D Y20mil Y10mil,X1/3D X1/3D Y20 mil Y10 mil,註：為明瞭起見,焊點上的錫已省去。Note:In order to clarify the figure,the solder joint be eliminated,D,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳面之對準度 SMD Assembly workmanship criteria-Gull-Wing footprint alignment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)。(S5mil)1.The length of the lead footprint shifted off the land(X)shall less 1/2 width of lead2.The clearance(S)between lead shifted off and land shall over 5 mil,允收狀況(Accept Condition),W S,X1/2W S5mil,X1/2W S5mil,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)(MI)。(S5mil)3.Whichever is rejected.,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳趾之對準度SMD Assembly workmanship criteria-Gull-Wing toe alingnment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過焊墊側端外緣。1.The lead had shifted and footprint not over the end of land,1.各接腳側端外緣，已 超過焊墊側端外緣(MI)。1.The lead had shifted and footprint had over the end of land(MI),允收狀況(Accept Condition),W W,已超過焊墊側端外緣,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-鷗翼(Gull-Wing)零件腳跟之對準度 SMD Assembly workmanship criteria-Gull-Wing heel alingnment,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.All the leads footprint is centered on the lands,1.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，最少保有一個接腳厚度(XT)。1.The lead had shifted the length from lead heel to end of land(X)shall be over the thickness of land(T),1.各接腳己發生偏滑，腳跟剩餘焊墊的寬度，已小於接腳 厚度(XT)(MI)。,允收狀況(Accept Condition),T X,T X T,T XT,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面與腳跟焊點最小量SMD solder joint workmanship criteria-Minimum solder of Gull Wing footprint,1.引線腳的側面,腳跟吃錫良好2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible,1.引線腳的底邊與板子焊墊間的 銲錫帶至少涵蓋引線腳長的 2/3L以上。2.腳跟(Heel)焊錫帶涵蓋高度h 大於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角需90度。1.Width of solder fillet between lead and land(X)shall over 2/3 lead footprint(L)2.Minimum solder fillet flows up end more than 1/2 thickness of lead on heel3.Wetting angle 90on heel,1.引線腳的底邊與板子焊墊間的 銲錫帶不足涵蓋引線腳長的 2/3L。2.腳跟(Heel)焊錫帶涵蓋高 度 h小於零件腳1/2厚度。(h1/2T)。3.腳跟(Heel)沾錫角90度。(MI)4.Whichever is rejected.,允收狀況(Accept Condition),L,X=2/3L,L,X2/3L,h1/2T,T,h1/2T,T,理想狀況(Target Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳面焊點最大量SMD solder joint workmanship criteria-Maximum solder of Gull Wing footprint,1.引線腳的側面,腳跟吃錫良好。2.引線腳與板子焊墊間呈現凹面 焊錫帶。3.引線腳的輪廓清楚可見。1.side face and footprint have good solder fillet 2.concave fillet between land and lead3.the shape(profile)of lead be clearly visible,1.引線腳與板子焊墊間的焊錫連接很好且呈一凹面焊錫帶。2.引線腳的側端與焊墊間呈現稍 凸的焊錫帶。3.引線腳的輪廓可見。1.Good solder flow up and concave fillet between land and lead2.Concave solder fillet between side face of lead and land3.The shape(profile)of lead(footprint)be clearly visible,1.焊錫帶延伸過引線腳的 頂部(MI)。2.引線腳的輪廓模糊不清(MI)。3.Whichever is rejected.1.solder flow cover the end(TIP)of lead2.The shape(profile)of lead not be visible clearly3.Whichever is rejected,拒收狀況(Reject Condition),允收狀況(Accept Condition),理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-鷗翼(Gull-Wing)腳跟焊點最大量SMD solder joint workmanship criteria-Minimum solder of Gull Wing Heel,1.腳跟的焊錫帶延伸到引線上彎 曲處底部(B)與下彎曲處頂部(C)間的中心點。註：引線上彎頂部：引線上彎底部：引線下彎頂部：引線下彎底部1.Solder flow up to the center between B,C point on the heel of lead,1.腳跟的焊錫帶已延伸到引線上彎曲處的底部(B)。1.solder flow up to B point on the heel,1.腳跟的焊錫帶延伸到引線上 彎曲處的底部(B)，延伸過 高，且沾錫角超過90度，才 拒收(MI)。1.Solder flow up over(cross)B point and the wetting angle over 90 degree,允收狀況(Accept Condition),沾錫角超過90度,A,B,D,C,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-J型接腳零件之焊點最小量SMD solder joint workmanship criteria-Minimum solder of J type lead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact,1.焊錫帶存在於引線的三側2.焊錫帶涵蓋引線彎曲處兩 側的50%以上(h1/2T)。1.Solder concave fillet on the 3 face of lead2.Height of solder flow-up on the lead angle(h)shall over 1/2 angle height(T),1.焊錫帶存在於引線的三側以 下(MI)。2.焊錫帶涵蓋引線彎曲處兩側 的50%以下(h1/2T)(MI)。3.Whichever is rejected.1.Solder concave fillet is less 3 face2.Height of solder flow-up on the lead angle(h)under 1/2 angle height(T)3.Whichever is rejected,允收狀況(Accept Condition),h1/2T,A,T B,h 1/2T,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT零件組裝工藝標準-J型腳零件對準度SMD Assembly workmanship criteria-J type lead alignment,1.各接腳都能座落在焊墊的中 央，未發生偏滑。1.All the leads footprint is centered on the lands,允收狀況(Accept Condition),S W,S5mil X1/2W,S1/2W,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，已超過接腳本身寬度的1/2W(MI)。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以下(MI)。(S5mil)3.Whichever is rejected.,1.各接腳已發生偏滑，所偏 出焊墊以外的接腳，尚未 超過接腳本身寬度的1/2W。(X1/2W)2.偏移接腳之邊緣與焊墊外緣之垂直距離5mil(0.13mm)以上。(S5mil)The lead had shifted off the land1.The length of lead shifted off the land(X)shall less 1/2 width of lead(W)2.The clearance distance between shifted lead and land edge shall over 5 mil,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-J型接腳零件之焊點最大量工藝水準點SMD solder joint workmanship criteria-Maximum solder of J type lead,1.凹面焊錫帶存在於引線的四側2.焊錫帶延伸到引線彎曲處 兩側的頂部(A,B)。3.引線的輪廓清楚可見。4.所有的錫點表面皆吃錫良好。1.Solder concave fillet on the 4 face of lead2.solder flow up to the angle high point A,B3.Lead shape(profile)can be clearly visible4.Good soldering joint at every solder contact,1.凹面焊錫帶延伸到引線彎 曲處的上方,但在組件本體的下方。2.引線頂部的輪廓清楚可見。1.Solder flow up to top of lead angle and not touch the body2.Shape(profile)of lead angle can be visible clearly,1.焊錫帶接觸到組件本體(MI)。2.引線頂部的輪廓不清楚(MI)。3.錫突出焊墊邊(MI)。4.Whichever is rejected.1.Solder had touched the body2.Shape(profile)of lead angle can not be visible clearly3.Excess solder on the side of solder land,允收狀況(Accept Condition),A,B,理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-晶片狀(Chip)零件之最小焊點(三面或五面焊點)SMD solder joint workmanship criteria-Minimum solder fillet of chip component(3 or 5 face terminations),1.焊錫帶延伸到晶片端電極高度的25%以上。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊的距離為晶片高度的25%以上。(X1/4H)1.1/4 component height be fillet by solder at least2.Solder flow spread on the land shall 1/4 width of component height at least,(Count from tip of component),1.焊錫帶延伸到晶片端電極高度的25%以下(MI)。(h1/4T)2.焊錫帶從晶片外端向外延伸到焊墊端的距離為晶片高度的25%以下(MI)。(X1/4T)3.Whichever is rejected.,允收狀況(Accept Condition),T,h1/4 T X1/4 T,h1/4 T X1/4 T,1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的2/3T以上。2.錫皆良好地附著於所有可 焊接面。1.Solder flow up from land(bottom of component solder termination to the 2/3 Height of component(T)2.Good solder fillet on the all solder able terminations(face),理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊點性工藝標準-晶片狀(Chip)零件之最大焊點(三面或五面焊點)SMD solder joint workmanship criteria-Maximum solder fillet of chip component(3 or 5 face terminations),1.焊錫帶稍呈凹面並且從晶 片端電極底部延伸到頂部。2.錫未延伸到晶片端電極頂 部的上方。3.錫未延伸出焊墊端。4.可看出晶片頂部的輪廓。1.Solder concave fillet be formed from land to top of component2.Solder do not overhang component3.Solder do not spread out of land 4.Shape(profile)of component termination be visible,1.錫已超越到晶片頂部的上方(MI)。2.錫延伸出焊墊端(MI)。3.看不到晶片頂部的輪廓(MI)。4.Whichever is rejected.,允收狀況(Accept Condition),H,1.焊錫帶是凹面並且從晶片端電極底部延伸到頂部的 2/3H以上。2.錫皆良好地附著於所有可 焊接面。1.Solder flow up from land(bottom of component solder termination to the 2/3 Height of component(T)2.Good solder fillet on the all solder able terminations(face),理想狀況(Target Condition),拒收狀況(Reject Condition),SMT焊錫性工藝標準-焊錫性問題(錫珠、錫渣)SMD solder joint workmanship criteria-Other solder issue(solder ball,solder dross),1.無任何錫珠、錫渣殘留於PCB。1.No solder ball and solder dross leave on PCB,1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長 度L10mil。(D,L10mil)1.The diameter of solder ball/solder dross which can remove or not shall small than 10 mil,1.錫珠、錫渣不論可被剝除者 或不易被剝除者,直徑D或長 度L10mil。(D,L10mil)(MI)且10mil每平方英寸不得超過5顆2.Whichever is rejected.,允收狀況(Accept Condition),可被剝除者D 10mil,可被剝除者D 10mil,不易被剝除者L 10mil,不易被剝除者L 10mil,理想狀況(Target Condition),拒收狀況(Reject Condition),允收狀況(Accept Condition),X0,X0,Y,YT,YT,X,1.各接腳都能座落在各焊 墊的中央，而未發生偏 滑。1.The footprint of every lead be centered on the land,1.各接腳已發生偏滑，引線 腳的側面仍保留在焊墊 上(X0),2.各接腳已發生偏滑，腳跟剩餘焊墊的寬度，最少保有一個接腳厚度(YT)。Footprint had shifted1.Side face still on the land(X0)2.The space from end of land to heel shall over the thickness of lead,1.各接腳己發生偏滑，引線腳 的側面已超出焊墊(X0)。2.各接腳已發生偏滑，腳跟 剩餘焊墊的寬度，小於一個 接腳厚度(YT)。,SMT零件組裝工藝標準-功率晶體(Mosfet)零件之對準度SMD Assembly workmanship criteria-Mosfet component alignment,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-臥式零件組裝之方向與極性DIP component Assembly workmanship criteria-Direction and polarity of horizontally,mounted,1.零件正確組裝於兩錫墊中央。2.零件之文字印刷標示可辨識。3.非極性零件文字印刷的辨識排 列方向統一。（由左至右，或 由上至下）1.Component are centered between their lands2.Component markings are visible3.Non-polarized components need to be oriented so that marking all read the same way(Left-to-right or top-to bottom),1.極性零件與多腳零件組裝正確。2.組裝後,能辨識出零件之極性符號3.所有零件按規格標準組裝於正確位置。4.非極性零件組裝位置正確，但文字印刷的辨示排列方向未統一(R1,R2)。1.Polarized and multi-lead components are oriented correctly2.Polarization symbols are visible after assembly3.All components are as specified and terminate to correct lands4.Non-polarized components need not be oriented,1.使用錯誤零件規格(錯件)(MA)。2.零件插錯孔(MA)。3.極性零件組裝極性錯誤(MA)(極反)4.多腳零件組裝錯誤位置(MA)。5.零件缺組裝(MA)。(缺件)6.Whichever is rejected。1.Component is not as specified(Wrong parts)2.Component not mounted in correct holes3.Polarized component mounted backwards(Wrong oriented)4.Multilead component not oriented correctly5.Component are missing(missing parts)6.Whichever is rejected.,允收狀況(Accept Condition),+,R1,+C1,Q1,R2,D2,+,R1,+C1,Q1,R2,D2,+,C1+,D2,R2,Q1,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-立式零件組裝之方向與極性DIP component Assembly workmanship criteria-Direction&polarity of vertically mounted,1.無極性零件之文字標示辨識 由上至下。2.極性文字標示清晰。1.The marking of non-polarized component can be identified.From top to down 2.Polarized marking be clearly,1.極性零件組裝於正確位置。2.可辨識出文字標示與極性。1.Polarized component are mounted with correct oriental at right location2.Marking and polarized symbol are identified cleatly,1.極性零件組裝極性錯誤(MA)。(極反)2.無法辨識零件文字標示(MA)。3.Whichever is rejected。,允收狀況(Accept Condition),1000F 6.3F,+,-,-,-,+,1000F 6.3F,+,+,+,-,-,-,+,1016+,332J,1000F 6.3F,+,-,-,-,+,1016+,332J,J233,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-零件腳長度標準DIP component Assembly workmanship criteria-Length of component lead,1.插件之零件若於焊錫後有浮高 或傾斜,須符合零件腳長度標準。2.零件腳長度以 L 計算方式:需從PCB沾錫面為衡量基準，可目視零件腳出錫面為基準。1.The protrusion length of component meet the spec even this parts tilted or floating2.The protrusion length(L)be measured from land to tip of lead,1.不須剪腳之零件腳長度,目視 零件腳露出錫面。2.須剪腳之零件腳長度下限標準(Lmin)，為可目視零件腳 出錫面為基準。3.一般零件腳最長長度(Lmax)低於2.5mm。(L2.5mm)4.特殊零件腳腳長規定：4.1 Coil零件腳最長長度(Lmax)低於3mm(L3mm)4.2 XTAL/電容腳距2.5mm(含)以下之零件，腳最長長度(Lmax)低於2mm(L2mm)1.Non-trimed lead protrusion lead be identified on solder side2.Lmin of trimed protrusion lead Minimum length is the protrusion lead profile be identified3.Lmax2.5mm(for general components)4.Special spwc of components:Coil Lmax3mmXtal Lmax2mm(the clearance between two lead is less 2.5mm width),允收狀況(Accept Condition),Lmin:零件腳出錫面,Lmax Lmin,Lmax:L2.5 mm,Lmin:零件腳未出錫面,Lmax Lmin,Lmax:L2.5 mm(特殊零件依特殊零件規定),L,L,1.無法目視零件腳露出錫面(MI)。2.Lmin長度下限標準，為可目視零件腳未出錫面，Lmax零件腳最長之長度2.5mm(MI)。(L2.5mm)3.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。4.特殊零件腳腳長Lmax判定拒收(MI)。5.Whichever is rejected.1.Protrusion lead can not be visible2.Protrusion lead out of spec(include Lmin or Lmax)3.Lead bend/missing/no-through4.Special spec of protrusion lead out of spec(Lmax)5.Whichever is rejected,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-臥式電子零組件(R,C,L)浮件與傾斜(1)DIP component Assembly workmanship criteria-Tilt&floating of horizontal electronic component(R,C,L),1.零件平貼於機板表面。2.浮高判定量測應以PCB零件面與零件基座之最低點為量測依據。1.Component is perpendicular and base is parallel to board surface2.The floating height is measured from face of PCB substrate to the lowest point of component,允收狀況(Accept Condition),+,1.量測零件基座與PCB零件面之最大距離須2.0mm。(Lh2.0mm)2.零件腳未折腳與短路。3.臥式COIL之Lh2mm.Wh2mm)不受第1點之限制1.The height of the component body above the land“Lh”is 2.0mm maximum2.No leads be shorted or bended of component3.Coil floating be specified to 2mm maximum,傾斜/浮高Lh2.0 mm,傾斜Wh2.0 mm,傾斜/浮高Lh2.0 mm,傾斜Wh2.0 mm,1.量測零件基座與PCB零件面之最大距離2.0mm(MI)。(Lh2.0mm)2.零件腳折腳、未入孔、缺件等缺點影響功能(MA)。3.臥式COIL之Lh或Wh2mm判定距收(MI)。4.Whichever is rejected,理想狀況(Target Condition),拒收狀況(Reject Condition),DIP零件組裝工藝標準-臥式電子零組件(Wire)浮件與傾斜(2)DIP component Assembly workmanship criteria-Tilt&floating of horizontal electronic component(Wire),1.單獨跳線平貼於機板表面。2.固定用跳線不得浮高,跳線需 平貼零件。1.Jumper wire lay flat and touch the board2.Jumper wire used for fixing component shall touch the component body,1.單獨跳線Lh,Wh1.0mm。2.被固定零件浮高1.0mm。(Y1.0mm)3.固定用跳線投影於PCB後左右偏移量零件孔邊緣1.0mm。(X1.0mm)4.固定用跳線浮高Z0.8mm(被固定零件平貼於PCB時)1.The height of jumper wire above the land is 1.0mm Maximum2.Jumper wire used for fixing component is 0.8mm maximum3.The shift length of reflection of jumper wire us