MEMS(数字)麦克风基本知识.ppt
,MEMS Microphone 产品简介,1.体积小.2.便于SMT安装.3.耐高温,稳定性好.4.灵活的设计应用.5.兼容数字化发展.6.自动化程度高.7.适合大批量生产.,MEMS Microphone,MEMS Microphone Presentation,MEMS Microphone 产品简介,MEMS麦克风是由MEMS微电容传感器、微集成转换电路(放大器)、声腔及RF抗噪电路组成。MEMS微电容极头部分包含接收声音的硅振膜和硅背极,硅振膜可直接将接收到的音频信号经MEMS微电容传感器传输给微集成电路,微集成电路可将高阻的音频电信号转换并放大成低阻的音频电信号,同时经RF抗噪电路滤波,输出与手机前置电路相匹配的电信号.完成“声-电”转换.,MEMS Microphone 工作原理,MEMS Microphone 产品简介,V out,Silicon Back Plate,Silicon diaphragm,GND,RF Filter,MEMS Microphone Module Structure,V supply,MEMS Acoustic Sensor,ASIC,MEMS Microphone 产品简介,MEMS Wafer,MEMS Die,MEMS Microphone Wafer&MEMS Die,MEMS Microphone 产品简介,MEMS Microphone Profile,Acoustic port hole,L,W,H,4,2,1,3,PIN#FUNCTION1.OUTPUT,2.NO CONNECTION3.GROUND,4.POWER,MEMS Microphone 产品简介,MEMS Microphone Structure,1,2,3,6,7,8,5,4,MEMS Microphone 产品简介,Performance Comparison,MEMS Microphone 产品简介,Recommended Interface Circuit,AAC MEMS Microphone,Term3.Term2.,Term4,Term1,-,+,Vref,External Gain=-R1/R2(Set by customer),+,R2,R1,MEMS Microphone 产品简介,Solder Reflow Profile,Incoming Inspection,Wafer Sawing,Wafer Expand,SMT/glueing,Packaging/Cutting,Testing/Marking/Taping,Shipping Inspection,Packing,Wafer Fabrication,Packaging,Wafer Foundry,Pick up and place MEMS,Wire Bonding,Reliability Test,Wafer Testing,Wafer Inspection,Production Process,MEMS Microphone,MEMS Microphone 产品简介,Cellular Phone(CDMA,GSM,PCS),Camcorder Phone,MP3 Phone,PDA Phone etc.,Camcorder,Digital Camera etc.,Ear Phone MIC for Headsets,MP3,Bluetooth,etc.,Notebook Computer,Desk-Top ComputerVideo Door Phone etc.Cordless Phone,MEMS Wafer Fab.,MEMS Packaging,Application of Product,MEMS Microphone 产品简介,MEMS Mic,MEMS Mic,Application of Product,MEMS Microphone,List of Products,
