HDI印刷线路板流程介绍.ppt
HDI Manufacturing Process Flow,Pre-engineering,Pattern imaging,Etching,Laminating,Drilling,Desmear,Cu plating,Hole plugging,Cu plating,Belt Sanding,Laser Ablation,Mechanical drilling,Cu plating,Solder Mask,Gold plating,Routing,Electrical test,Pattern imaging,Hole counter,Shipping,Visual inspection,*Raw material(Thin Core,Copper,Prepreg.),Raw Material:FR-4(Difuntional,Tetrafuntional)Supplier:EMC,Nan-YaSheet size:36”*48”,40”*48”,42”*48Core Thickness:0.003”,0.004”,0.005”,0.006”0.008”,0.010”,0.012”,0.015”0.021”,0.031”,0.039”,0.047”Copper Foil:1/3 oz,1/2 oz,1.0 oz,2 ozPrepreg type:1080,2113,2116,1506,7628,7630,4.內層線路製作(顯影)(Develop),5.內層線路製作(蝕刻)(Etch),6.內層線路製作(去膜)(Strip Resist),7.黑氧化(Oxide Coating),8.疊板(Lay-up),9.壓合(Lamination),10.鑽孔(Drilling),11.電鍍Desmear&Copper Deposition,12.塞孔(Hole Plugging),13.去溢膠(Belt Sanding),14.減銅(Copper Reduction)Option,15.去溢膠(Belt Sanding)Option,16.外層壓膜 Dry Film Lamination(Outer layer),17.外層曝光 Expose,18.After Exposed,19.外層顯影 Develop,20.蝕刻 Etch,20.去乾膜 Strip Resist,21.壓合(Build-up Layer Lamination),21.護形層製作(壓膜)(Conformal Mask),22.護形層製作(曝光)(Conformal Mask),Before Exposure,After Exposure,23.護形層製作(顯像)(Conformal Mask),24.護形層製作(蝕銅)(Conformal Mask),25.護形層製作(去膜)(Conformal Mask),26.雷射鑽孔(Laser Ablation)及機械鑽孔,27.機械鑽孔(Mechanical Drill),28.電鍍(Desmear&Copper Deposition),29.外層線路製作(Pattern imaging),壓膜(D/F Lamination),曝光(Exposure),顯像(D/F Developing),蝕銅(Etching),去膜(D/F Stripping),30.防焊(綠漆)製作(Solder Mask),WWEI94V-0,R105,31.S/M 顯像(S/M Developing),32.印文字(Legend Printing),33.浸金(噴錫)製作(Electroless Ni/Au,HAL),Dedicate or universal Tester,Flying Probe Tester,34.成型(Profile),35.測試(Electrical Testing),36.終檢(Final Inspection),37.O.S.P.(entek plus Cu_106A.)Option,LASER BLIND&BURIED VIA LAY-UP,A=THROUGH VIA HOLE(導通孔),B=BURIED VIA HOLE(埋孔),C=One Level Laser Blind Via(雷射盲孔),LASER BLIND&BURIED VIA LAY-UP,BURIED VIA AND LASER BLIND VIA OPTION(雷射盲埋孔之選擇),D,C,C,D=Two Level Laser Via(雷射盲孔),C,D,C,B-STAGE,FR-4 Core,RCC,A,B,B,A,BURIED VIA LAY-UP,A=THROUGH VIA HOLE(導通孔),B=BURIED VIA HOLE(埋孔),C=BLIND VIA HOLE(盲孔),D=BLIND HOLE MLB VIA(多層盲孔),BLIND VIA LAY-UP,BLIND VIA SEQUENTIAL LAY-UP,A,B,B,A,RESIN,B-STAGE,BLIND AND BURIED VIA OPTION(盲 埋 孔 之 選 擇),D,A,C,C,E=VIA IN PAD(VIP)(導通孔在pad裡面),E,Conventional PCB,Photo-Imageable Dielectric(PID),Conventional PCB,Blind Via PCB,Q&A,END,
