AD PCB封装转Allegro封装或者AD PCB转Allegro PCB.doc

AD PCB封装转Allegro封装或者AD PCB转Allegro PCB一.AD原理图转OrCAD原理图AD版本要用AD6.9的，AD9不行，另存时会有错误，步骤如下：1.直接建一个只有原理图的项目。2.另存为OrCAD (.dsn)项目。如下图：另存选择OrCAD格式3.用Capture 打开保存的DSN文件即可。打开时会等一会，原理图尺寸大的会等的久一点。4.注意点：原理图尺寸不能太大张，原理图尺寸在A3或A3以下转出来比较好，太大张会出现器件丢失的现象。小尺寸会也会出现小问题，如，器件错位，一般是电阻电容类会有错位。我估计是AD原理图用的同一类器件时引用的库不一样引起的。二.AD原理图库转OrCAD原理图库步骤如下：1.先在AD原理图导出AD 的原理图库，如果本来就有原理图库可以不用导出。打开有原理图的工程，菜单命令：Design => Make Schematic Library2.另存为OrCAD 格式的库文件另存选择OrCAD格式库文件3.另存后直接用Capture打开即可4.注意：AD原理图库转OrCAD原理图库时，AD版本没有要求，我试了AD6.9和AD9都可以。三.AD PCB封装转Allegro封装或者AD PCB转Allegro PCB.AD封装转ALLEGRO封装时，要把所有封装放到一张PCB上或者分批次的放到PCB上，把PCB转成ALLEGRO格式的，然后再用ALLEGRO导出PCB封装步骤如下：1.用PADS Layout (PADSVX.0)直接导入AD格式的PCB导入选择AD格式的PCB2. PADS Layout (PADSVX.0)导出ASCII文件（*.asc）导出选择导出ASCII文件（*.asc）ASCII选项如上图，格式可选Power PCBV3.0 到V5.0,以及PADS Layout9.3以下版本都可以。3.把ASCII文件（*.asc）导入到ALLEGRO，ALLEGRO 用的是V16.6版本的，其他的版本没有试。如下：选择导入PADS格式的文件导入和转换后输出文件路径选择，以及层的配置文件选择。按转换会弹出这窗口出来，按“是”确认。左上角会有一个窗口弹出来，等待让它转换完成。转换完成并成功4.用Allegro打开刚才转换成功并保存的文件丝印框和阻焊层都有。5.Allegro 到处PCB封装方法：执行菜单命令：File => Export => Librarys6.不足：转换的层配置文件，层配置好后仍然有一些封装焊盘的阻焊层和钢网层没有出来。需要手工进行完善。7.ini层配置文件说明：allegro自带的原始文件类容如下：OptionsCreateSolderLayers=0SolderOversize=0Line Map0=BOARD GEOMETRY|ALL1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=UNUSED|-22=UNUSED|-23=UNUSED|-24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=UNUSED|-29=UNUSED|-30=UNUSED|-Copper Map0=BOARD GEOMETRY|ALL1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=UNUSED|-22=UNUSED|-23=UNUSED|-24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=UNUSED|-29=UNUSED|-30=UNUSED|-Text Map0=BOARD GEOMETRY|ALL1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=UNUSED|-22=UNUSED|-23=UNUSED|-24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=UNUSED|-29=UNUSED|-30=UNUSED|-Decal Map0=PACKAGE GEOMETRY|SILKSCREEN_TOP1=PACKAGE GEOMETRY|SILKSCREEN_TOP2=UNUSED|-3=UNUSED|-4=UNUSED|-5=UNUSED|-6=UNUSED|-7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=UNUSED|-22=UNUSED|-23=UNUSED|-24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=UNUSED|-29=UNUSED|-30=UNUSED|-Pad Map0=ETCH|internal_pad_def1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=UNUSED|-22=UNUSED|-23=UNUSED|-24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=UNUSED|-29=UNUSED|-30=UNUSED|-Via Map0=VIA CLASS|internal_pad_def1=VIA CLASS|TOP2=VIA CLASS|INTERNAL13=VIA CLASS|INTERNAL24=VIA CLASS|INTERNAL35=VIA CLASS|INTERNAL46=VIA CLASS|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=UNUSED|-22=UNUSED|-23=UNUSED|-24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=UNUSED|-29=UNUSED|-30=UNUSED|-我自己更改后的层配置文件类容如下：OptionsCreateSolderLayers=0.0254  这里我改了发现也没变化SolderOversize=0.0254      这里我改了发现也没变化Line Map0=BOARD GEOMETRY|ALL1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=PACKAGE GEOMETRY|SOLDERMASK_TOP22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM23=PACKAGE GEOMETRY|PASTEMASK_TOP24=UNUSED|-25=UNUSED|-26=PACKAGE GEOMETRY|SILKSCREEN_TOP27=UNUSED|-28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM29=PACKAGE GEOMETRY|SILKSCREEN_BOTTOM30=UNUSED|-Copper Map0=BOARD GEOMETRY|ALL1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=PACKAGE GEOMETRY|SOLDERMASK_TOP22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM23=PACKAGE GEOMETRY|PASTEMASK_TOP24=UNUSED|-25=UNUSED|-26=PACKAGE GEOMETRY|SILKSCREEN_TOP27=UNUSED|-28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM29=PACKAGE GEOMETRY|SILKSCREEN_BOTTOM30=UNUSED|-Text Map0=BOARD GEOMETRY|ALL1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=PACKAGE GEOMETRY|SOLDERMASK_TOP22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM23=PACKAGE GEOMETRY|PASTEMASK_TOP24=UNUSED|-25=UNUSED|-26=PACKAGE GEOMETRY|SILKSCREEN_TOP27=UNUSED|-28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM29=PACKAGE GEOMETRY|SILKSCREEN_BOTTOM30=UNUSED|-Decal Map0=PACKAGE GEOMETRY|SILKSCREEN_TOP1=PACKAGE GEOMETRY|SILKSCREEN_TOP2=UNUSED|-3=UNUSED|-4=UNUSED|-5=UNUSED|-6=UNUSED|-7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=PACKAGE GEOMETRY|SOLDERMASK_TOP22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM23=PACKAGE GEOMETRY|PASTEMASK_TOP24=UNUSED|-25=UNUSED|-26=PACKAGE GEOMETRY|SILKSCREEN_TOP27=UNUSED|-28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM29=PACKAGE GEOMETRY|SILKSCREEN_BOTTOM30=UNUSED|-Pad Map0=ETCH|internal_pad_def1=ETCH|TOP2=ETCH|INTERNAL13=ETCH|INTERNAL24=ETCH|INTERNAL35=ETCH|INTERNAL46=ETCH|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=PACKAGE GEOMETRY|SOLDERMASK_TOP22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM23=PACKAGE GEOMETRY|PASTEMASK_TOP24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM29=UNUSED|-30=UNUSED|-Via Map0=VIA CLASS|internal_pad_def1=VIA CLASS|TOP2=VIA CLASS|INTERNAL13=VIA CLASS|INTERNAL24=VIA CLASS|INTERNAL35=VIA CLASS|INTERNAL46=VIA CLASS|BOTTOM7=UNUSED|-8=UNUSED|-9=UNUSED|-10=UNUSED|-11=UNUSED|-12=UNUSED|-13=UNUSED|-14=UNUSED|-15=UNUSED|-16=UNUSED|-17=UNUSED|-18=UNUSED|-19=UNUSED|-20=UNUSED|-21=PACKAGE GEOMETRY|SOLDERMASK_TOP22=PACKAGE GEOMETRY|PASTEMASK_BOTTOM23=PACKAGE GEOMETRY|PASTEMASK_TOP24=UNUSED|-25=UNUSED|-26=UNUSED|-27=UNUSED|-28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM29=UNUSED|-30=UNUSED|-配置层的关系从哪里看出来的呢？从PADSLayout 里面的层定义可以看出来，执行如下的菜单命令：设置=层定义，然后会弹出如下的窗口：然后从这个层定义去看丝印或者阻焊是属于哪一层的，比如：Silkscreen Top是第26层；Silkscreen Bottom是在第29层，Solder Mask Top是在第21层，Solder Mask Bottom 是在第28层，然后在相应的对象类型里面给他指定对应关系。比如在Pad 焊盘这中类型Pad Map里面加上Solder Mask Top，和 Solder MaskBottom这个两层的对应关系，因为焊盘这种类型原则上是没有Silkscreen Top和Silkscreen Bottom的，所以焊盘里面可以不用加丝印的层对应关系。然后分别在21和28改为如下的对应关系。21=PACKAGE GEOMETRY|SOLDERMASK_TOP28=PACKAGE GEOMETRY|SOLDERMASK_BOTTOM