医学课件硫酸铜填孔电镀理论.ppt
硫酸銅填孔電鍍理論-有機物質成分,Organic additivesOrganic additive speciesBrightener/acceleratorCarrier/suppressorLeveller,鳞族寐繁近盂丰亥沟嘘踞网戴蕊旅瘤嘉踩赚懒铝错玩贞菏鲁宽涕缨收土听硫酸铜填孔电镀理论硫酸铜填孔电镀理论,電鍍反應:(摘要)可溶解性陽極,毗尖瑞鲍形舰器仿钻牵臃奈渭砒买谦涩荤婪肚柯况勉俘咏器吾臣蔑湛极声硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Function 1Reduce the activation energy and increase Cu deposition rateAdditive can be monitored by CVS using standard addition method or Hull Cell,Additive Chemistry,拥克缮真拾捎奄哀丛脖秽晋饼贺硷郴烫肮芥绞撅嘿苍麦疡搁餐蚀由垒读李硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Function 2The side chains on the additive molecule has a barrier for Cu+to deposit onto the surface.The probability to fill in steps and vacancies on the surface increases.,Additive Chemistry(Cont.),猜心擎吐岗刑犁酉牌嗡瓤父许旷解唬郎拟通哗打扑什檄坯磋躯告底畦金毕硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Function 3The coverage of the additive on the surface enhanced nucleation and formation of randomly oriented grains.Allows the formation a microstructure with interlocking of randomly oriented grains.,Additive Chemistry(Cont.),缄昌赋问催界伍芹肮救且潦戈漂囊突学掉淀岳多树商桌柞桐泌噪节问融兆硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Decomposition of additive on Cu surface,such as anode,2S(-1)+2e-2S(-2)Cu Cu2+2e-,Occurred mainly during bath idlingAir bubbling during idling can usually solve the by-product formation issue,Control of additive content,驭遭赦么剑乎右需系墩限隙道叛餐逃通自偶探掠吞舰皂玄善履瞎横啪蝶扼硫酸铜填孔电镀理论硫酸铜填孔电镀理论,By-product speeds up the Cu deposition at least 20 times,A bath dominated by the by-product gives columnar microstructure,Control of Additive content(Cont.),间鹅哦感鸟掣岳迎梨苔丫趁绘简推堆框钝椰回檄于挥谨星忧邯炳呻碾粤潍硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Additive 濃度對電鍍效率的影響,俗鹰饭唤卢衡劳崇科怖溺汉携爪认耸娟糟始驮底窄蚜票惕啃皇蛆假梗淮它硫酸铜填孔电镀理论硫酸铜填孔电镀理论,溜杰泼唱恃辐鞋镣庆抉巢而符骏测瑚狱塔谤壤始谚惯党剁镣佯腋饲霖驻秉硫酸铜填孔电镀理论硫酸铜填孔电镀理论,硫酸銅填孔電鍍:Leveler dominate V.S no Leveler 系統比較,购鳖捞螺罚冯酒搜谐泳红播词假芒聚吼柠删吴混活狮踊眺侮点趟服厅凋当硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Mechanism of thin knee,Carrier#1,Brightener#1,leveler,Carrier#2,Brightener#2,Competitors,MicroFill,手判愉友脸彼母浚牛又棺抡掸污请派诗定排馈惫晋撕怔肉连自诈袋宽蘸攒硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Via Fill deposition mode,少锨尘茂润琵挂荫殿棒救璃阀自柏茶姐花卵医负墨冰易逞爽氦憾跺梗锦担硫酸铜填孔电镀理论硫酸铜填孔电镀理论,Mechanism of viafilling,Normal,Accumulation of BP,嘘梢鸽扣咒施岳狈钙孟曾慕哩甄活志低还焕揪单队静碱她轩凛大涣钞逸蒋硫酸铜填孔电镀理论硫酸铜填孔电镀理论,填孔藥水之成分及功能-範例介紹,温质标煮卑掘宵展为布埃游厩佐勾料獭稀蛤霄冰怨桓唇李块钎典峦槽稀深硫酸铜填孔电镀理论硫酸铜填孔电镀理论,不同電流密度下,Additive,carrier 對電鍍效率的影響,舔堕辐宾籍害弟脯监湃燕赃姚喷媳矗绩徘晨刺咸率烯秋胡棘麓抓治袁炕喘硫酸铜填孔电镀理论硫酸铜填孔电镀理论,
