TDSCDMA无线协议（英文版）.doc

3GPP TR 25.834 V4.1.0 (2001-03)Technical Report3rd Generation Partnership Project;Technical Specification Group Radio Access Network;UTRA TDD Low Chip Rate Option;Radio Protocol Aspects(Release 4)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented. This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification.Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, radio, protocol3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16Internethttp:/www.3gpp.orgContentsForeword51Scope62References63Definitions and abbreviations63.1Definitions63.2Abbreviations64Background and Introduction85Overview of Physical Layer of TDD Low Chip Rate Option85.1Frame structure85.2Burst Types96Services and Functions of the Physical Layer of 1.28 Mcps TDD106.1General106.2Overview of L1 functions106.3L1 interactions with L2 retransmission functionality107Model of physical layer of the UE107.1Uplink models107.2Downlink models108Formats and configurations for L1 data transfer108.1General concepts about Transport Channels108.2Types of Transport Channels109UE Simultaneous Physical Channels combinations129.11.28 Mcps TDD Uplink129.21.28 Mcps TDD Downlink1310Measurements provided by the physical layer1510.1Model of physical layer measurements1510.2UE Measurements1510.3UTRAN Measurements1510.3.1Received SYNC_UL Timing Deviation1510.4Compressed Mode to Monitor 1.28Mcps TDD1511Primitives of the physical layer1611.1Generic names of primitives between layers 1 and 21611.2Generic names of primitives between layers 1 and 31611.2.1STATUS PRIMITIVES1611.2.2CONTROL PRIMITIVES1611.3Parameter definition1611.3.1Error code1611.3.2Event value1611.3.3Access Information1611.3.4Transport Format Subset1611.3.5Physical channel description1611.3.5.1DwPTS1711.3.5.2UpPTS1711.3.5.3FPACH1711.3.5.4 PRACH1712Layer 2 Services and Functions1712.1MAC Services and Functions1712.1.1MAC Services to upper layers1712.1.1MAC functions1812.2RLC Services and Functions1812.3PDCP Services and Functions1812.4Broadcast/Multicast Control - Services and Functions1813Layer 3 - Uu Stratum Services and Functions1813.1Uu Stratum services1813.2RRC functions1813.3RRC Protocol Aspects1813.3.1Discussion on Physical Channel Parameters for 1.28 Mcps TDD1813.3.1.1Parameters required to define physical channels in 1.28Mcps TDD:1813.3.1.2Handling of coded composite transport channels of dedicated or shared type in 1.28Mcps TDD:1913.3.2Parameter description for 1.28Mcps TDD1913.3.2.1Parameters for RACH procedure specification1913.3.2.2Parameters required to define the primary CCPCH2013.3.2.3Parameters required to define the secondary CCPCH2013.3.2.4Parameters required to define the PICH2013.3.2.5Parameters required to define shared channels2013.3.2.6Additional parameters to be broadcast2013.3.2.7 Parameter required to inform the usage of TSTD2113.3.2.8 Information element for propagation delay measurement2113.3.3Information elements for 1.28Mcps TDD2213.3.3.1Dedicated physical channel information2213.3.3.2Shared channel information2313.3.3.3RACH procedure information elements2413.3.3.4Common channel information elements2613.3.3.5Additional information elements for BCH2713.3.3.6 Additional information element for TSTD2713.3.3.7 Information element for Propagation Delay Measurement2813.3.4IE change example for 1.28Mcps TDD2814Key Procedures of TDD Low Chip Rate Option2914.1RACH Procedure2914.1.1Basic RACH Mechanism2914.1.2Control of RACH Transmissions for 1.28 Mcps TDD3014.1.3Modifications of Primitives to Support RACH3114.1.4ASC/AC concept for 1.28 Mcps TDD3214.2Uplink Synchronization Procedure3315Cell (Re)Selection3315.1States and Transitions in Idle Mode3315.2Cell Selection Process3315.2.1Initial and Stored Information Cell Selection3315.2.2Cell Selection Criteria3315.3Immediate Cell Evaluation Process3315.4Cell Reselection in Idle Mode3315.4.1Measurement Rules for Cell-Reselection3315.4.2Cell Reselection Criteria3415.4.3Cell Reselection Parameters in system information broadcasts3415.5Cell Status and Cell Reservations / Access Control3415.6Cell Reselection in Connected Mode3416Handover Procedures3416.1Handover Between 1.28 Mcps TDD Cells3416.2Handover from UMTS FDD and 3.84 Mcps TDD Cells to a 1.28 Mcps TDD Cell3616.3Handover to UMTS FDD and 3.84 Mcps TDD Cells from a 1.28 Mcps TDD Cell3616.4Handover from 1.28 Mcps TDD Cells to Cells of a Non-UMTS System3716.5Handover from Cells of a Non-UMTS System to Cells of 1.28 Mcps TDD3717Recommendations37Annex A: Change history38ForewordThis Technical Report has been produced by the 3rd Generation Partnership Project (3GPP).The contents of the present document are subject to continuing work within the TSG and may change following formal TSG approval. Should the TSG modify the contents of the present document, it will be re-released by the TSG with an identifying change of release date and an increase in version number as follows:Version x.y.zwhere:xthe first digit:1presented to TSG for information;2presented to TSG for approval;3or greater indicates TSG approved document under change control.ythe second digit is incremented for all changes of substance, i.e. technical enhancements, corrections, updates, etc.zthe third digit is incremented when editorial only changes have been incorporated in the document.1ScopeThe present document describes the services provided by the physical layer and the layer 2/3 functionality for support of the 1.28 Mcps low chip rate option of UTRA TDD. Based on the protocol structure existing for UTRA TDD / FDD, it is identified which modifications will be required in order to enable the layer 1 characteristics and key features of the low chip rate option.2ReferencesThe following documents contain provisions which, through reference in this text, constitute provisions of the present document.· References are either specific (identified by date of publication, edition number, version number, etc.) or nonspecific.· For a specific reference, subsequent revisions do not apply.· For a non-specific reference, the latest version applies. In the case of a reference to a 3GPP document (including a GSM document), a non-specific reference implicitly refers to the latest version of that document in the same Release as the present document.13GPP TS 25.928: "1.28 Mcps functionality for UTRA TDD Physical Layer".23GPP TS 25.302: "Services provided by the Physical Layer".33GPP TR 25.990: "Vocabulary for the UTRAN".43GPP TS 25.321: "MAC Protocol Specification".53GPP TS 25.331: "RRC Protocol Specification".63GPP TR 25.921: "Guidelines and Principles for protocol description and error handling".73GPP TS 25.222: "Multiplexing and Channel Coding (TDD)".83GPP TS 25.304: "UE Procedures in Idle Mode and Procedures for Cell Reselection in Connected Mode".93GPP TS 25.212: "Multiplexing and Channel Coding (FDD)".103GPP TS 25.215: "Physical Layer Measurements (FDD)".113GPP TS 25.223: "Spreading and modulation (TDD)".3Definitions and abbreviations3.1DefinitionsFor the purposes of the present document, the terms and definitions given in 3 apply.3.2AbbreviationsFor the purposes of the present document, the following abbreviations apply:ACAccess ClassASCAccess Service ClassBCCHBroadcast Control ChannelBCHBroadcast ChannelBMCBroadcast/Multicast ControlC-Control-CCTrCHCoded Composite Transport ChannelCNCore NetworkDCCHDedicated Control ChannelDCHDedicated ChannelDLDownlinkDSCHDownlink Shared ChannelDwPTSDownlink Pilot TimeslotFACH Forward Link Access ChannelFDDFrequency Division DuplexFPACHFast Physical Access ChannelGPGuard PeriodHOHandoverITUInternational Telecommunication Unionkbpskilo-bits per secondL1Layer 1 (physical layer)L2Layer 2 (data link layer)L3Layer 3 (network layer)MACMedium Access ControlP-CCPCHPrimary Common Control Physical ChannelPCH Paging ChannelPDCPPacket Data Convergence ProtocolPDSCHPhysical Downlink Shared ChannelPHYPhysical layerPhyCHPhysical ChannelsPICHPaging Indicator ChannelP-RACHPhysical Random Access ChannelPUSCHPhysical Uplink Shared ChannelRABRadio Access BearerRACHRandom Access ChannelRBRadio BearerRLCRadio Link ControlRNCRadio Network ControllerRNSRadio Network SubsystemRNTIRadio Network Temporary IdentityRRCRadio Resource ControlRSCPReceived Signal Code PowerRxReceiveSAPService Access PointS-CCPCHSecondary Common Control Physical ChannelSCHSynchronization ChannelSIRSignal to Interference RatioSRNCServing Radio Network ControllerSRNSServing Radio Network SubsystemSSSynchronization ShiftTDDTime Division DuplexTFCITransport Format Combination IndicatorTFITransport Format IndicatorTPCTransmit Power ControlTsTimeslotTxTransmitU-User-UEUser EquipmentULUplinkUMTSUniversal Mobile Telecommunications SystemUpPTSUplink Pilot TimeslotUSCHUplink Shared ChannelUTRAUMTS Terrestrial Radio AccessUTRANUMTS Terrestrial Radio Access Network4Background and IntroductionTDD low chip rate option is a Release 4 work item that was agreed in RAN#7 plenary meeting. This work item involves the introduction of functionality to enable the physical layer structure of TDD low chip rate option within the existing UTRA layers.This report identifies the required modifications within the UTRA layers 2/3. Basically, the layer 2/3 services and functions need not be changed. Emphasis must be put on the fact that it is tried to reuse existing functionality as much as possible for enabling the TDD low chip rate option. Addition or modification of some elements or parameters in comparison with the existing layer 2/3 will however be needed due to the specific physical layer structure and key features of the TDD low chip rate option and the aim of this report is to show where this is the case.5Overview of Physical Layer of TDD Low Chip Rate OptionThis clause contains some basic information about frame and burst structure of physical layer of TDD low chip rate option. More information on physical layer characteristics of TDD low chip rate option can be found in 1.5.1Frame structureFor low chip rate option, the frame length is 10ms and the 10ms frame is divided into 2 sub-frames of 5ms. The frame structure for each sub-frame in the 10ms frame length is the same. The frame structure for each sub-frame is shown in Figure 1.Figure 1: Structure of the sub-frame for TDD low chip rate optionTsn (n from 0 to 6): the nth normal time slot, 864 chips duration;DwPTS: downlink pilot time slot, 96 chips duration;UpPTS: uplink pilot time slot, 160 chips duration;GP: main guard period for TDD operation, 96 chips duration;In Figure 1, the total number of normal traffic time slots for uplink and downlink is 7, and the length for each normal time slot is 864 chips duration. Among the 7 normal traffic time slots, Ts0 is always allocated as downlink while Ts1 is always allocated as uplink. The time slots for the uplink and the downlink are separated by a switching point. Between the downlink time slots and uplink time slots, the special period is the switching point to separate the uplink and downlink. In each sub-frame of 5ms for low chip rate option, there are two switching points (uplink to downlink and vice versa). The proposed frame structure has taken some new technologies into consideration, both the smart antenna (beam forming) technology and the uplink synchronisation will be well supported.5.2Burst TypesIn correspondence to the frame structure described above, the burst structures for Tsn, DwPTS and UpPTS are proposed. The burst structure for normal time slot (Tsn) is described in Figure 2.Figure 2: Burst structure for normal traffic time slotThe structure for DwPTS and UpPTS is described in Figure 3 and Figure 4.Figure 3: Structure for DwPTSFigure 4: Structure for UpPTSIn Figure 2, the data symbols in each side of the midamble are 352 chips. The TPC bits for power control, the TFCI bits and the additional uplink synchronization bits (synchronization shift) are included in the Data symbols fields of the burst if they are needed. The amount of TFCI bits used is depending on the service and the details for TFCI, synchronization shift and TPC bits should be provided later with service mapping. For the power control symbols, the uplink synchronization control symbols and the TFCI the symbols around the midamble are used.The GP field in Figure 2 for each time slot is used for protection between time slots to avoid the long delay multi-path interference. It should be noted that the GP of the TS0 together with the guard period in DwPTS is 48 chips long which is different with other normal guard period of 16 chips between time slots. This 'super long' guard period can be used to avoid the interference between the last normal downlink time slot and the downlink synchronization pilot burst. Otherwise, the interference to the last downlink time slot from the strong powered pilot will be serious to the traffic; and vice versa, the interference to the downlink pilot burst from the last downlink time slot will decrease the performance on downlink synchronization and cell search. Note that if the UEs serving Node B is far away and the UE makes handover measurements it will receive the beginning of the DwPTS of a close by Node B inside these 48 chips. 48 chips correspond to 11 km difference in distance to the Node B. If the other Node B is more distant to the serving Node B, big guard period can be used for receiving the DwPTS of the handover candidate Node B.In DwPTS and UpPTS, the content of SYNC and SYNC1 field are used for downlink and uplink pilot. The GP fields are used to separate the downlink (uplink) pilot from the normal downlink (uplink) time slot.It should be pointed out that the uplink synchronization burst (SYNC1) is not followed by a RACH