切片缺点模式说明.ppt
切片缺點模式說明Cross-section Defect Mode,內容介紹(CONTENT),1.通孔(Through via)1.1.熱應力前(Before thermal stress test)1.1.1.孔銅厚度/穿孔力(Copper thickness/Throwing power)1.1.2.鍍銅斷裂(Plating crack)1.1.3.孔破(Plating void)1.1.4.壓合空泡(Air bubble)1.1.5.燈蕊效應(Wicking)1.1.6.回蝕(Etch back)1.1.7.反回蝕(Negative etch back)1.1.8.釘頭(Nail Head)1.1.9.ICD-膠渣(Smear)1.1.10.ICD-內層銅分離(Inner layer connection separation)1.1.11.孔壁粗糙度(Hole wall roughness),內容介紹(CONTENT),1.2.熱應力後(After thermal stress test)1.2.1.孔壁浮離(Pull away)1.2.2.樹脂內縮(Resin recession)1.2.3.內層連接不良(Innerlayer Connection Defect)1.2.4.鍍銅斷裂(Crack)2.盲孔(Blind via)2.1.一般盲孔2.1.1.銅厚(Copper thickness)2.1.2.碗型孔(Barrel Shaped)2.1.3.蟹腳(Crab feet)2.1.4.雷射膠渣(Laser smear)2.1.5.跳鍍(Step plating)2.1.6.孔破(bubble void)2.2.電鍍填孔(Fill via by plating)2.2.1.填孔凹陷(Dimple)2.2.2.空泡(Air bubble),內容介紹(CONTENT),3.外觀檢查(Visual inspection):3.1.背光(Back Light)3.2.板面燒焦(Burning)3.3.電鍍顆粒(Copper Nodule)3.4.鍍銅均勻性(Uniformity)3.5.凹陷(Pin&Dent)3.6.刮傷(Scrab)3.7.板面粗糙(Panel roughness)3.7.板面氧化(Surface Oxide),1.1.1.a 孔銅銅厚：Hole copper thickness,Criteria:Min.0.8 Mil(),123,456,1,量測孔徑，以確保切片準確性,1.1.1.b 面銅銅厚：Surface copper thickness,7,9,10,8,1.1.1.c 穿孔力：Throwing Power,通孔銅厚之最小值 面銅平均值(不含基材銅),穿孔力=,Throwing Power=,Minimum of hole copper thicknessAverage of surface copper thickness,Specification:P.P thickness75Mil T/P=75%(),1.1.1.c 穿孔力：Through Power,1.1.2.鍍銅斷裂：Plating crack,Criteria:Not Allowed,Crack,1.1.3.孔破：Plating void,Criteria:Not Allowed,NG,1.1.4.壓合空泡：Air bubble,Criteria:Not Allowed,1.1.5.燈蕊效應(Wicking),Accept,Reject,Spec.:3 mil,1.1.6.回蝕(Etch back),Reject,Spec.:3 mil,Accept,1.1.7.反回蝕(Negative etch back),Accept,Reject,Spec.:1 mil,1.1.8.釘頭(Nail Head),Accept,Reject,Spec.:B/A 1.7 for 1 oz B/A 2.0 for 0.5 oz,1.1.9.ICD-膠渣(Smear),膠渣造成ICD(Smear causes ICD),Not Allowed,1.1.10.ICD-內層銅分離(Inner plane separation),Reject,Reject,1.1.11.孔壁粗糙度(Hole wall roughness),Spec.:1.4 mil,1.2.1.孔壁浮離(Pull Away),Reject,Spec.:浮離部份之長度板厚20,1.2.2.樹脂內縮(Resin recession)(after T/S test),Spec.:Width:Max.3 milNo longer 20%of cumulative base material thickness.,Spec.:最大：3.0MIL，且內縮部份之長度板厚20,1.2.2.樹脂內縮計算方式(Resin recession measuring),1.2.3.內層連接不良(ICD)(after T/S test),Reject,Reject,1.2.4.鍍銅斷裂(Crack)(after T/S test),Reject,Reject,2.1.1.銅厚(Copper thickness),2.1.2.碗型孔(Barrel shaped),B,A,B/A 1.16,2.1.3.蟹腳(Under cut),Under CutMax.10 um,Spec.:10um,2.1.4.雷射膠渣(Smear),Reject,2.1.5.跳鍍(Step plating),2.1.6.盲孔孔破(Void),2.2.1.填孔：Dimple,Dimple 10 m,Criteria:Max.10 m,量測數據(measuring):1.Dimple2.P.P厚度(P.P.thickness)3.上開口(Top width)4.下開口(Bottom width),2,3.,4,2.2.1.填孔：Dimple,2.2.2.盲孔空泡(Air bubble),3.1.背光(Back Light),SPEC.8級,
