杜邦產品介紹.ppt
Introduction to Flexible Circuit Materials,Presented by:Jonathan C.Li,m,Part II:(40 minutes),簡報大綱,軟性電路板基材之介紹基材的主要CompositionDielectric Substrates(絕緣體)Adhesive(膠質)Conductor(導體),m,簡報大綱(continue),杜邦產品壓克力膠系列(Modified WA Acrylic)之基材環亞樹脂膠系列(Modified Epoxy)之基材杜邦 料號解說PyraluxTelcam,m,軟性電路板之主要基材,Copper Clad Laminates(銅箔基材)Single-Sided C.C.L.(單面銅箔基材),Adhesive,Conductor,Dielectric Substrate,m,Double-Sided C.C.L.(雙面銅箔基材),Conductor,Dielectric Substrate,Adhesive,軟性電路板之主要基材,m,Adhesive-Less C.C.L.(無膠銅箔基材),Dielectric Substrate,Conductor,軟性電路板之主要基材,m,Coverlay(覆蓋膜),軟性電路板之主要基材,m,Stiffner(補強材),軟性電路板之主要基材,Dielectric Substrate,Adhesive,m,Bondply,Dielectric Substrate,Adhesive,Adhesive,軟性電路板之主要基材,m,Mylar,Adhesive,Kapton,Adhesive,Sheet AdhesivePhotoImageable Coverlay(PIC)Dry FilmFine-Line ApplicationCameraAutomotiveOthers,軟性電路板之主要基材,m,Dielectric Substrates,DefinitionA base film on which the printed conductors are laid.A film which provides electrical insulation between conductors.A film which provides mechanical strength of the circuit.,m,必備之特性Mechanical StrengthFlexibilityDimensional StabilityDielectric PropertiesThermal PropertiesChemical ResistanceMoisture AbsorptionCost,Dielectric Substrates,m,Substrates 之種類PolyimidePolyesterFluorocarbonAramid PaperComposite,Dielectric Substrates,m,Polyimide:Popularized by DuPont under“Kapton”Also known as PI First choice of film in most FPCInfusible and flame retardantHigh Tg(約 260C-280C)Good dimensional stability,Substrates,m,Substrates,Polyester:Popularized by DuPont under“Mylar”Also known as PETLowest cost dielectric materialMostly used in low-cost consumer applicationGood mechanical propertiesBad thermal properties,m,Substrates,Aramid Paper:Sold under DuPont trade name“Nomex”Used in specialized applicationGood thermal insulation material,m,Property Polyester Polyimide Fluorocarbon Aramid Paper Composite,Tensile Strength Excellent Excellent Fair Good Best,Flexibility Excellent Excellent Excellent Good Fair/Good,Dim.Stability Fair/Good Good Fair Good Fair/Good,Dielectric Str.Good Good Very Good Very Good Good,Solderibility Poor Excellent Fair Excellent Excellent,C.O.T.(C)105 200-230 150-180 220 105-180,Thermal Exp.Low Low High Moderate Low,Chem.Resist.Good Good Excellent Very Good Fair,Moisture Absorp.Very Low High Very Low Very High Low,Cost Low High High Moderate Moderate,Trade Name Mylar Kapton Teflon/Tedlar Nomex,Dielectric Substrates,m,Adhesive,DefinitionMaterial that bonds layers togetherThermosettingThermoplastic,m,Adhesive,必備之特性Adhesion StrengthFlexibilityChemical ResistanceThermal ResistanceMoisture AbsorptionElectrical PropertiesCost,m,Adhesive,Adhesive之種類PolyesterAcrylicEpoxyPolyimideButyral Phenolic,m,Adhesive,Polyester:Used where the dielectric is also polyesterUsed where no soldering is neededTypical application:Instant camera film interconnectsInstrument cluster connection in automobiles,m,Adhesive,Acrylic:Used in demanding temperature requirement applicationMost popular acrylic system is Pyralux by DuPontExcellent adhesion,m,Adhesive,Epoxy:Widely used adhesive systemGenerally lower cost than acrylicAble to stand wave solderingGood in high temperature for long period of time(400 to 450 F),m,Adhesive,Polyimide:Used in adhesiveless ccl and coverlayUsed where dimension stability is criticalUsed in high temperature applicationHigh moisture absorption,m,Adhesive,Polyester,Acrylic,Epoxy,Polyimide,Butyral Phenolic,Temp.Resist.,Chem.Resit.,Elec.Prop.,Adhesion,Flexibility,Cost,Moisture,Fair,Good,Excellent,Excellent,Excellent,Low,Fair,Very Good,Good,Good,Excellent,Very Good,Good,Good,Good,Good,Good,Excellent,Excellent,Excellent,Good,Good,Good,Good,Good,Good,Moderate,Fair,Fair,Very High,Poor,Fair,Fair,High,Moderate,Poor,m,Conductors/Foil,Major types of conductorsMetalsMetal alloysconductive inksCopper(the most commonly used conductor in FPC)Electrolytically deposited copper(ED)Rolled Annealed copper(RA),m,Conductors/Foil,必備之特性Current-carrying capacityFlexibilityService temperatureChemical resistanceMechanical strengthCost,m,Conductors/Foil,Electrical Properties,Thermal Properties,Mechanical Properties,Relative Cost,Aluminum,Copper,Gold,Nickel,Silver,Excellent,Good,Excellent,Excellent,Excellent,Excellent,Excellent,Excellent,Good,Good,Good,Good,Good,Fair,Fair/Good,Fair,Fair,Very Good,Very Good,Best,m,軟板基材製造過程,Copper Roll,Kapton Roll,Copper Clad Laminate,Heater 1,Heater 2,Liquid Adhesive,Aging,m,Introduction to DuPont Products,m,Part III:(15 minutes),DuPont Product Family,PyraluxPyralux FRPyralux LFPyralux APPyralux PC,TeclamTeclam FNCTeclam DNC,Pyralux,FR-series(Acrylic Based)Copper-Clad LaminatesPanel Form Packaging.(24”x 36”)UL Approved.(File#E124294)Very Good Flexure EnduranceEx.FR9111,FR9110,FR8510,FR8515CoverlayRoll Form Packaging.(24”x 250)UL Approved.(File#E124294)Excellent Dimensional StabilityEx.FR0110,FR0210,m,Pyralux,FR continue.Sheet AdhesiveRoll Form Packaging.(24”x 250)UL ApprovedEx.FR0100,FR0200Bond PlyRoll Form Packaging.(24”x 250)UL ApprovedEx.FR0111,FR0212,m,Pyralux,LF-series(Acrylic Based)Military SpecificationsExcellent Flexure EnduranceVery Good for High-Density CircuitrySame Product Offerings as FR-seriesPC-series(Acrylic,urethane,&imide-based)Dry FilmPhotoimageable CoverlayCameras&Automotive Applications,m,Pyralux P/Ns,FR 9 111,CuPICu,7-Special construction8-1/2oz.C.C.L.9-1oz or more C.C.L.,5-1/2 oz.Cu1-1 oz.Cu2-2 oz.Cu,1-1 mil PI2-2 mil PI3-3 mil PI,FRLFAP,Copper-Clad Laminates,m,Pyralux P/Ns,FR 0 111,Adh.PIAdh.,FRLFAP,7-Special construction0-Coverlay or Sheet Adhesive,1-1 mil adhesive2-2 mil adhesive3-3 mil adhesive,1-1 mil PI2-2 mil PI3-3 mil PI,Coverlay&Sheet Adhesive,m,Teclam,FNC-seriesCopper-Clad LaminatesUL ApprovedGood Flexure EnduranceRoll Form Packaging(250/500mm x 100M)Ex.FNCRA110,FNC110CoverlayUL ApprovedRoll Form PackagingEx.FNCC510,FNCC510-20,m,DNC-seriesUL ApprovedLeast RepellencyGood Peeling StrengthExcellent Heat&Humidity ResistanceExcellent TransparencySame Product Offering as FNC,Teclam,m,Teclam,Coverlay,FNCC510-20,FNCDNC,C-Coverlay5-Coverlay,1-1 mil PI2-2 mil PI,No Meaning,15-15m Adhesive20-20m Adhesive35-35m Adhesive,m,Teclam,Copper-Clad Laminates,FNCRA910,FNCDNC,RA-RA Cu.-ED Cu.,1-1 mil PI2-2 mil PI7-1/2 mil PI,1-1 oz.Cu.2-2 oz.Cu.9-1/2 oz.Cu.,m,Q&A,m,Part IV:,
