SOP封装工艺流程介绍课件.ppt
SOP ASSEMBLY PROCESS FLOW & QUALITY CONTROL INSTRUCTION,Contents,Package InstructionProcess FlowQuality Control,Package Instruction,SOP,SSOP,3. TSSOP,4. MFP,ASE,ASE,Package Instruction,ASY process flow,Wafer Saw,Die Attach,Wire Bond,Wafer Mount,Wafer Grinding,Epoxy Cure,Molding,Post Mold Cure,Plating,Trim/Form,Packing & Shipping,De-junk,Laser Marking,前段制程,后段制程,Wafer,Die (chip),Die on Lead frame,Before,After,Laser Marking,Laser Marking,Laser Marking,Wafer Grinding,LOAD,UNLOAD,GRINGING,Purpose:Grinding the wafer to Customer required thickness,Wafer Grinding,晶圓 (未研磨),研磨機,晶圓 (研磨後),晶元背面Wafer backside,Frame,Mount Tape,Purpose: Combine the wafer with Dicing tape onto the frame for die sawing,Wafer mount Machine,Wafer Mount,Frame,Purpose: To separate dies from each other for die attach,Monitor,Load/Unload,Sawing,Cleaning,Machine,Wafer Saw,Before wafer saw:,After wafer saw:,Wafer Saw,Purpose:Attach the dies with epoxy on substrate for the following process,Die Attach,Output,Die bond,Substrate load bond,Working flow:,Die Attach,Robber tip,Lead-frame,Purpose: Solidify the epoxy after D/A,Inside,Oven,Epoxy Cure,Purpose: Connecting the chip and the exterior circuit,input,Theory: Use ultrasonic, thermal, force to form the intermetallic between golden wire and joint metal (Al, Au, Ag),Wire Bond,Mold Machine,Molding,Purpose: Seal the product with EMC to prevent die, gold wire from being damaged, contaminated and oxygenic.,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Plunger,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,Plunger,Molding,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,Plunger,Molding,After Mold,Molding,Top chase,Air vent,Bottom chase,Cavity,Leadframe,Pot,Gate insert,Runner,Compound,Bottom cull block,Top cull block,Plunger,Purpose： Use laser light irradiated by CO2 or YAG to vapour the EMC to show content on the package，such as date, schedule, place of production and so on.,Laser Marking,laser,EMC vapoured,Before,After,Laser marking,Oven,Inside,Purpose: To let EMC react completely so that products can be protected more effectively.,Post mold cure,De-junk,Purpose： Remove the dem-bar of leadframe.,Working area,Before,After,Laser Marking,Laser Marking,Plating,Purpose: To plating Sn on the lead which will mount on board pad.,load,unload,Plating line,Plating,After,Before,Purpose: Remove the tie-bar and lead-frame and form products to units from strips, fill them into tubes and then pass to next process.,Trim Form,Saw work area,unload,Working area,unload,Laser marking,Trim Form,Working area,Laser marking,Lead Cut,Forming,Quality Control,Die Saw,切偏,Chipping,外观检查,划片宽度量测,Rej,Rej,Quality Control,Die Shear,Epoxy Void Check,Die Attach,Quality Control,Epoxy Thickness & Fillet Height,Die Attach,Die Location,Rej,Quality Control,Wire Bond,外观检查,第二焊点重叠,Rej,Rej,Rej,Rej,第二焊点偏移,线弧不良,Rej,Rej,Quality Control,推球测试,拉力测试,Wire Bond,Quality Control,Wire Bond,验证级工程确认,IMC Coverage,IMC Thickness,Crater Test,1st bond,1st bond,2nd bond,Looping,Quality Control,Mold,Looping,外观检查,上下错位,孔洞,缺角,溢胶,内部气泡,冲线值量测,Rej,Rej,Rej,Rej,Rej,Plating,外观检查,Solderability test,镀层厚度量测,Quality Control,170C烘烤8小时，9095C蒸汽老化10小时。锡覆盖率95%,Rej,Rej,Rej,Quality Control,Tirm/Form,毛刺,脚偏,漏底材,长短脚,脚弯,异物附着,外观检查,外形尺寸量测,超声波扫描,Rej,Rej,Rej,Rej,Rej,Rej,
